Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Paste Jetting Within a Solder Paste Inspection Process
In the electronics industry,consumer demand drives a large portion of product innovations. Consumers want greater functionality and power,while maintaining a small footprint. Due to this demand
.. read more
Printing of Solder Paste – A Quality Assurance Methodology
Solder paste printing is known to be one of the most difficult processes to quality assure in electronic manufacturing. The challenge increases as the technology development moves toward a mix
.. read more
Nano Technology Improve Critical Printing Process
The challenges of successful solder printing in the High Volume / Low Mix cell phone environment,which is linked with the continuing trend to miniaturize electronic assemblies,requires a new ap
.. read more
Effect of Squeegee Blade on Solder Paste Print Quality
The solder paste deposition process is viewed by many in the industry as the leading contributor of defects in the Surface Mount Technology (SMT) assembly process. As with all manufacturing pro
.. read more
Telecommunications Case Studies Address Head-In-Pillow (Hnp) Defects and Mitigation through Assembly Process Modifications and Control
One of the most perplexing phenomena in the electronic manufacturing industry today is the defect called “head-in-pillow.”
Head-in-Pillow (HnP) defects occur on the blind solder joints of area
.. read more
Closed Loop Printer Control
Stencil printing is a critical first step in surface mount assembly. It is often cited that the solder paste printing operation causes about 50%-80% of the defects found in the assembly of PCBs
.. read more
Solder Paste Inspection Technologies: 2D-3D Correlation
It is understood that the solder paste printing process presents far more opportunities for defects than any of the other individual Surface Mount Technology (SMT) Manufacturing Processes. In a
.. read more
What to Consider when Designing a Universal Test Strategy Tool
Selecting an optimal test strategy is a complex task today. There are many test inspection and test methods available. The
most common choices to find manufacturing defects on printed circuit b
.. read more
Test and Inspection as Part of the Lead-Free Manufacturing Process
The paper will address issues that will impact defect levels and defect spectrum during the transition to lead-free
manufacturing. Since there are exemptions of which product types are mandated
.. read more
A Case Study of In-Process Inspection Methods to Improve First Pass Yields
The electronics content of many consumer products has increased substantially over the past decade. Several of the
electronics added to the automobile control vehicle functions that have a dire
.. read more
Paste Jetting Within a Solder Paste Inspection Process
In the electronics industry,consumer demand drives a large portion of product innovations. Consumers want greater functionality and power,while maintaining a small footprint. Due to this demand
.. read more
Printing of Solder Paste – A Quality Assurance Methodology
Solder paste printing is known to be one of the most difficult processes to quality assure in electronic manufacturing. The challenge increases as the technology development moves toward a mix
.. read more
Nano Technology Improve Critical Printing Process
The challenges of successful solder printing in the High Volume / Low Mix cell phone environment,which is linked with the continuing trend to miniaturize electronic assemblies,requires a new ap
.. read more
Effect of Squeegee Blade on Solder Paste Print Quality
The solder paste deposition process is viewed by many in the industry as the leading contributor of defects in the Surface Mount Technology (SMT) assembly process. As with all manufacturing pro
.. read more
Telecommunications Case Studies Address Head-In-Pillow (Hnp) Defects and Mitigation through Assembly Process Modifications and Control
One of the most perplexing phenomena in the electronic manufacturing industry today is the defect called “head-in-pillow.”
Head-in-Pillow (HnP) defects occur on the blind solder joints of area
.. read more
Closed Loop Printer Control
Stencil printing is a critical first step in surface mount assembly. It is often cited that the solder paste printing operation causes about 50%-80% of the defects found in the assembly of PCBs
.. read more
Solder Paste Inspection Technologies: 2D-3D Correlation
It is understood that the solder paste printing process presents far more opportunities for defects than any of the other individual Surface Mount Technology (SMT) Manufacturing Processes. In a
.. read more
What to Consider when Designing a Universal Test Strategy Tool
Selecting an optimal test strategy is a complex task today. There are many test inspection and test methods available. The
most common choices to find manufacturing defects on printed circuit b
.. read more
Test and Inspection as Part of the Lead-Free Manufacturing Process
The paper will address issues that will impact defect levels and defect spectrum during the transition to lead-free
manufacturing. Since there are exemptions of which product types are mandated
.. read more
A Case Study of In-Process Inspection Methods to Improve First Pass Yields
The electronics content of many consumer products has increased substantially over the past decade. Several of the
electronics added to the automobile control vehicle functions that have a dire
.. read more