Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Basic PCB Level Assembly Process Methodology for 3D Package-on-Package
The motivation for developing higher density IC packaging continues to be the market and the consumers’ expectation that
each new generation of products furnish greater functionality. The minia
.. read more
Stacked Array Packaging A Flex Based IC Packaging Solution for Single and 3D Multiple Die Applications
The challenge manufactures face when competing in the world marketplace is to offer a product that will meet all performance and functionality expectations without increasing product size or co
.. read more
The Evolution of 3D IC Packaging for Portable and Hand Held Electronics
Increased electronic functionality can be achieved through the development of more complex silicon integration but that course generally requires a great deal of capital resources and an excess
.. read more
Basic PCB Level Assembly Process Methodology for 3D Package-on-Package
The motivation for developing higher density IC packaging continues to be the market and the consumers’ expectation that
each new generation of products furnish greater functionality. The minia
.. read more
Stacked Array Packaging A Flex Based IC Packaging Solution for Single and 3D Multiple Die Applications
The challenge manufactures face when competing in the world marketplace is to offer a product that will meet all performance and functionality expectations without increasing product size or co
.. read more
The Evolution of 3D IC Packaging for Portable and Hand Held Electronics
Increased electronic functionality can be achieved through the development of more complex silicon integration but that course generally requires a great deal of capital resources and an excess
.. read more