Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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High Density PCB Technology for High Reliability Applications Using Low CTE Material
The space- and other high reliability markets are continuously driven towards an increased use of deeply integrated electronics. The increasing demand for complexity and functionality result
.. read more
Challenge: Sourcing ELIC Substrates in the U.S.
Every layer interconnect (ELIC) printed wiring boards (PWB) were sourced after D-coupon evaluation per IPC-TM-650 2.6.27B. U.S. and off-shore D-coupons were tested to assess reflow survivabi
.. read more
IPC/IMEC/ESA Microvia TV Introduction
This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structu
.. read more
Lessons Learned While Investigating Microvia Reliability Failures.
Micro vias, be they mechanically, or more typically laser drilled have revolutionized the technical capabilities of today PCBs. Their high hit rate, and low-cost during manufacture, in combi
.. read more
Design and Construction Affects on PWB Reliability
The reliability,as tested by thermal cycling,of printed wire boards (PWB) are established by three variables; copper quality,material robustness and design. The copper quality was most influent
.. read more
High Density PCB Technology for High Reliability Applications Using Low CTE Material
The space- and other high reliability markets are continuously driven towards an increased use of deeply integrated electronics. The increasing demand for complexity and functionality result
.. read more
Challenge: Sourcing ELIC Substrates in the U.S.
Every layer interconnect (ELIC) printed wiring boards (PWB) were sourced after D-coupon evaluation per IPC-TM-650 2.6.27B. U.S. and off-shore D-coupons were tested to assess reflow survivabi
.. read more
IPC/IMEC/ESA Microvia TV Introduction
This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structu
.. read more
Lessons Learned While Investigating Microvia Reliability Failures.
Micro vias, be they mechanically, or more typically laser drilled have revolutionized the technical capabilities of today PCBs. Their high hit rate, and low-cost during manufacture, in combi
.. read more
Design and Construction Affects on PWB Reliability
The reliability,as tested by thermal cycling,of printed wire boards (PWB) are established by three variables; copper quality,material robustness and design. The copper quality was most influent
.. read more