Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Key Issues in Bottom Termination Component (BTC) Design and Assembly for Improved Reliability and Yield
With the release of IPC 7093,"Design and Assembly Process Implementation for Bottom Termination SMT Components," earlier this year,the term BTC is the newest acronym to enter the world of SMT.
.. read more
Investigation for Use of ‘Pin in Paste’ Reflow Process with Combination of Solder Preforms to Eliminate Wave Soldering
The Pin in Paste (PiP) technology is the process of soldering Pin through hole (PTH) components using the Surface Mount Technology (SMT) reflow process. The use of PiP process offers several ad
.. read more
Stencil Design Considerations to Improve Drop Test Performance
Future handheld electronic products will be slimmer than today and deliver more functions,enabled by innovative electronics
packaging design using smaller components with greater I/Os assembled
.. read more
Printing and Profiling Fine Feature Devices
To characterize the paste printing process,both the individual aspects of the process and the interactions between the
aspects must be understood. The main aspects of the printing process are p
.. read more
Key Issues in Bottom Termination Component (BTC) Design and Assembly for Improved Reliability and Yield
With the release of IPC 7093,"Design and Assembly Process Implementation for Bottom Termination SMT Components," earlier this year,the term BTC is the newest acronym to enter the world of SMT.
.. read more
Investigation for Use of ‘Pin in Paste’ Reflow Process with Combination of Solder Preforms to Eliminate Wave Soldering
The Pin in Paste (PiP) technology is the process of soldering Pin through hole (PTH) components using the Surface Mount Technology (SMT) reflow process. The use of PiP process offers several ad
.. read more
Stencil Design Considerations to Improve Drop Test Performance
Future handheld electronic products will be slimmer than today and deliver more functions,enabled by innovative electronics
packaging design using smaller components with greater I/Os assembled
.. read more
Printing and Profiling Fine Feature Devices
To characterize the paste printing process,both the individual aspects of the process and the interactions between the
aspects must be understood. The main aspects of the printing process are p
.. read more