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Thixotropy of Solder Paste Impacts Repeatability and Reproducibility of Rheometric Results
The widespread use of SAC-based (SnAgCu) lead-free solder paste drives the industry toward a smaller process window. This is due to higher reflow temperatures as well as the limited thermal res
.. read more
Wetting of Fresh and Aged Immersion Tin and Silver Surface Finishes by Sn/Ag/Cu Solder
The wetting of alternative PCB surface finishes,including immersion silver (I-Ag) and immersion tin (I-Sn),by
Sn/Ag/Cu solder and Sn/Pb solder,was studied in this work,along with electroless ni
.. read more
Thixotropy of Solder Paste Impacts Repeatability and Reproducibility of Rheometric Results
The widespread use of SAC-based (SnAgCu) lead-free solder paste drives the industry toward a smaller process window. This is due to higher reflow temperatures as well as the limited thermal res
.. read more
Wetting of Fresh and Aged Immersion Tin and Silver Surface Finishes by Sn/Ag/Cu Solder
The wetting of alternative PCB surface finishes,including immersion silver (I-Ag) and immersion tin (I-Sn),by
Sn/Ag/Cu solder and Sn/Pb solder,was studied in this work,along with electroless ni
.. read more