Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Root Cause Analysis and Risk Assessment of a Multilayer Ceramic Capacitor Flexural Crack Propagating Fault
Failure of a printed circuit board assembly (PCBA) can occur because of design, manufacturing, mechanical, or electrochemical issues. A propagating fault is a severe failure mechanism in whi
.. read more
FEA Study of Solder Hole Fill Impact on the Reliability of PTH Solder Joints
This paper is focused on the impact of solder hole fill on the reliability of the plated-through-hole (PTH) solder joints with different board thicknesses. Finite element analysis (FEA) is empl
.. read more
Root Cause Analysis and Risk Assessment of a Multilayer Ceramic Capacitor Flexural Crack Propagating Fault
Failure of a printed circuit board assembly (PCBA) can occur because of design, manufacturing, mechanical, or electrochemical issues. A propagating fault is a severe failure mechanism in whi
.. read more
FEA Study of Solder Hole Fill Impact on the Reliability of PTH Solder Joints
This paper is focused on the impact of solder hole fill on the reliability of the plated-through-hole (PTH) solder joints with different board thicknesses. Finite element analysis (FEA) is empl
.. read more