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An AI Method for Early Detection of Failures Caused by Corrosion on Components During Assembly - Correlated to Field Failure...
Corrosion is the most dominant failure mode in electronic products. In many cases, the failure seed is corrosion contamination already on the soldering leads before the assembly that propaga
.. read more
Enig – Corrosion: The Status, The Risks and The Solutions
The ENIG finish is one of the most common final finishes finding broad acceptance in the market for decades. ENIG is the abbreviation for “electroless nickel – immersion gold” where it is th
.. read more
Identifying Reliable Applications for the Tin-Zinc Eutectic in Electrical and Electronic Assemblies
With a melting point of 199°C,about 20°C lower than the liquidus temperature of SAC305 the Sn-Zn eutectic (Sn~9% Zn) appears to be an attractive candidate as a Pb-free solder. With,at July 2010
.. read more
An AI Method for Early Detection of Failures Caused by Corrosion on Components During Assembly - Correlated to Field Failure...
Corrosion is the most dominant failure mode in electronic products. In many cases, the failure seed is corrosion contamination already on the soldering leads before the assembly that propaga
.. read more
Enig – Corrosion: The Status, The Risks and The Solutions
The ENIG finish is one of the most common final finishes finding broad acceptance in the market for decades. ENIG is the abbreviation for “electroless nickel – immersion gold” where it is th
.. read more
Identifying Reliable Applications for the Tin-Zinc Eutectic in Electrical and Electronic Assemblies
With a melting point of 199°C,about 20°C lower than the liquidus temperature of SAC305 the Sn-Zn eutectic (Sn~9% Zn) appears to be an attractive candidate as a Pb-free solder. With,at July 2010
.. read more