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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Selective Soldering for Interconnection Technology Used in Enterprise Communication Apparatuses
At times,wave soldering or reflow involving the entire assembly are not applicable for soldering of components. Selective soldering techniques vary widely in their ability to produce high quali
.. read more
Effect of Lead-Free Alloys on Voiding at Microvia
For SnAgCu solders,the voiding rate at microvia was studied with the use of simulated microvia,and was the lowest with
95.5Sn3.8Ag0.7Cu and 95.5Sn3.5Ag1Cu. The voiding rate increased with decre
.. read more
Mechanical Bending Technique for Determining CSP Design and Assembly Weaknesses
A cyclic board-bending technique has been developed to ensure a reproducible multiaxial stress state at the Chip
Size Package (CSP) solder fillet. Mechanically stressing the package serves as a
.. read more
Selective Soldering for Interconnection Technology Used in Enterprise Communication Apparatuses
At times,wave soldering or reflow involving the entire assembly are not applicable for soldering of components. Selective soldering techniques vary widely in their ability to produce high quali
.. read more
Effect of Lead-Free Alloys on Voiding at Microvia
For SnAgCu solders,the voiding rate at microvia was studied with the use of simulated microvia,and was the lowest with
95.5Sn3.8Ag0.7Cu and 95.5Sn3.5Ag1Cu. The voiding rate increased with decre
.. read more
Mechanical Bending Technique for Determining CSP Design and Assembly Weaknesses
A cyclic board-bending technique has been developed to ensure a reproducible multiaxial stress state at the Chip
Size Package (CSP) solder fillet. Mechanically stressing the package serves as a
.. read more