Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A Multiphase Model of Intermittent Contact in Lubricated Sliding Electrical Contacts
Electrical contacts, although critically important for a wide range of applications, are susceptible to degradation due to fretting corrosion, especially when sliding and vibrations occur. T
.. read more
Signal Transmission Loss due to Copper Surface Roughness in
Higher-speed signal transmission is increasingly required on a printed circuit board to handle massive data in electronic systems. So,signal transmission loss of copper wiring on a printed circ
.. read more
Determination of Copper Foil Surface Roughness from Micro-section Photographs
Specification and control of surface roughness of copper conductors within printed circuit boards (PCBs) are increasingly desirable in multi-GHz designs as a part of signal-integrity failure an
.. read more
Effects of Tin Whisker Formation on Nanocrystalline Copper
Spontaneously forming tin whiskers,which emerge unpredictably from pure tin surfaces,have regained prevalence as a topic within the electronics research community. This has resulted from the RO
.. read more
Thermal Effects on PCB Laminate Material Dielectric Constant and Dissipation Factor
Values for printed circuit board (PCB) laminate dielectric constant (Dk) and dissipation factor (Df) used in circuit design and signal integrity (SI) modeling are typically those presented on l
.. read more
The Effect of the Incorporation of Tougheners on the Drillability of Epoxy-based Electrical Laminates
The transition to lead-free solders has presented significant challenges for the electronics industry. One of the challenges is that typical lead-free soldering temperatures are much higher tha
.. read more
Effect of Plasma Surface Treatment for Peel Strength of Metallization Based on Polyimide
The purpose of this study is to investigate the optimum plasma processing as a pre-treatment for the surface of Polyimide (PI) in order to increase adhesion strength of electroless copper (Cu)
.. read more
New Technology to Improve Etching Performance using Shiny Side Surface Treatment for HDI
This paper discusses a new technology to improve etching performance using shiny side surface treatment on copper foil. Until now,a lot of electro-deposited copper foils (ED foil) with very low
.. read more
Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
.. read more
Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
.. read more
Cupric Chloride-Hydrochloric Acid Microetch Roughening Process and its Applications
We have developed a cupric chloride-hydrochloric acid based microetchant process. This process provides a unique roughened copper surface,which yields excellent adhesion for both solder mask an
.. read more
Novel CCL Based on New Fluoropolymer Exhibits Extremely Low Loss Characteristics and New Evaluation Method for Separating Dielectric and Conductive...
We demonstrate here a novel CCL (Copper Clad Laminate),which exhibits an extremely low transmission loss at mm-wave band. The CCL,which we developed,is based on a new fluoropolymer with adhesiv
.. read more
Lead Free Solder Paste Printing: Stencil and Squeegee Blade Impact
Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global
electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi
.. read more
Profile-Free Copper Foil for High Density Wiring and High Frequency Application
Nowadays,the growth of electronic industry is remarkable. All electronic devices are getting smaller with higher performance and data
transmission speed. Therefore,we have developed a new profi
.. read more
Non-Classical Conductor Losses due to Copper Foil Roughness and Treatment
In high speed digital interconnects; signal attenuation is a result of both dielectric losses and conductor losses. Previous
works have showed in detail,the characterization and modeling effort
.. read more
New Materials for HDI Interconnect Applications
A study was conduced to see if faster laser ablation rates,improved fracture resistance and better copper adhesion
after electroless plating could be engineered into existing Resin Coated Foils
.. read more
A Multiphase Model of Intermittent Contact in Lubricated Sliding Electrical Contacts
Electrical contacts, although critically important for a wide range of applications, are susceptible to degradation due to fretting corrosion, especially when sliding and vibrations occur. T
.. read more
Signal Transmission Loss due to Copper Surface Roughness in
Higher-speed signal transmission is increasingly required on a printed circuit board to handle massive data in electronic systems. So,signal transmission loss of copper wiring on a printed circ
.. read more
Determination of Copper Foil Surface Roughness from Micro-section Photographs
Specification and control of surface roughness of copper conductors within printed circuit boards (PCBs) are increasingly desirable in multi-GHz designs as a part of signal-integrity failure an
.. read more
Effects of Tin Whisker Formation on Nanocrystalline Copper
Spontaneously forming tin whiskers,which emerge unpredictably from pure tin surfaces,have regained prevalence as a topic within the electronics research community. This has resulted from the RO
.. read more
Thermal Effects on PCB Laminate Material Dielectric Constant and Dissipation Factor
Values for printed circuit board (PCB) laminate dielectric constant (Dk) and dissipation factor (Df) used in circuit design and signal integrity (SI) modeling are typically those presented on l
.. read more
The Effect of the Incorporation of Tougheners on the Drillability of Epoxy-based Electrical Laminates
The transition to lead-free solders has presented significant challenges for the electronics industry. One of the challenges is that typical lead-free soldering temperatures are much higher tha
.. read more
Effect of Plasma Surface Treatment for Peel Strength of Metallization Based on Polyimide
The purpose of this study is to investigate the optimum plasma processing as a pre-treatment for the surface of Polyimide (PI) in order to increase adhesion strength of electroless copper (Cu)
.. read more
New Technology to Improve Etching Performance using Shiny Side Surface Treatment for HDI
This paper discusses a new technology to improve etching performance using shiny side surface treatment on copper foil. Until now,a lot of electro-deposited copper foils (ED foil) with very low
.. read more
Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
.. read more
Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
.. read more
Cupric Chloride-Hydrochloric Acid Microetch Roughening Process and its Applications
We have developed a cupric chloride-hydrochloric acid based microetchant process. This process provides a unique roughened copper surface,which yields excellent adhesion for both solder mask an
.. read more
Novel CCL Based on New Fluoropolymer Exhibits Extremely Low Loss Characteristics and New Evaluation Method for Separating Dielectric and Conductive...
We demonstrate here a novel CCL (Copper Clad Laminate),which exhibits an extremely low transmission loss at mm-wave band. The CCL,which we developed,is based on a new fluoropolymer with adhesiv
.. read more
Lead Free Solder Paste Printing: Stencil and Squeegee Blade Impact
Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global
electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi
.. read more
Profile-Free Copper Foil for High Density Wiring and High Frequency Application
Nowadays,the growth of electronic industry is remarkable. All electronic devices are getting smaller with higher performance and data
transmission speed. Therefore,we have developed a new profi
.. read more
Non-Classical Conductor Losses due to Copper Foil Roughness and Treatment
In high speed digital interconnects; signal attenuation is a result of both dielectric losses and conductor losses. Previous
works have showed in detail,the characterization and modeling effort
.. read more
New Materials for HDI Interconnect Applications
A study was conduced to see if faster laser ablation rates,improved fracture resistance and better copper adhesion
after electroless plating could be engineered into existing Resin Coated Foils
.. read more