Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Low Surface Energy Coatings,Rewrites the Area Ratio Rules
Paste release characteristics are driven by the Area Ratio formula,which is based upon conventional stencil foil materials such as a variety of stainless steel alloys,nickel,etc. The surface en
.. read more
Cleaning PCBs in Electronics: Understanding today’s Needs
Because of the phase out of CFC’s and HCFC’s,standard solder pastes and fluxes evolved from RA and RMA fluxes,to No-Clean,to low residue No-Clean,to very low residue No-Clean. Many companies ca
.. read more
Defluxing for New Assembly Requirements
Consider defluxing at the design stage. This involves determining how product design may impact the assembly process. It also involves selecting the most effective,rugged defluxing option relat
.. read more
Lead-Free Flux Technology and Influence on Cleaning
Lead-free flux technology for electronic industry is mainly driven by high soldering temperature,high alloy surface tension, miniaturization,air soldering due to low cost consideration,and envi
.. read more
OA Flux Cleaning Studies on Highly Dense Advanced Packages Parameters
Cleaning flux residues post soldering has been a high reliability criterion practiced by assemblers of military,aerospace,automotive,medical devices and other value offerings. Highly dense adva
.. read more
Case Study – “Limitations of DI-Water Cleaning Processes”
While most cleaning processes in the global electronics manufacturing industry still rely on cleaning with DI-water only (for OA flux removal),recent studies suggest that water is beginning to
.. read more
Relationship Between Via Size and Cleanliness
Microvia technology has many advantages: it requires a smaller designed area,which saves the board size and weight,using less space,allowing for a smaller PCB,which can results in lower costs,a
.. read more
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
Flux technology for lead-free alloys differs considerably from that for eutectic Sn/Pb solder systems,mainly for soldering and cleaning purpose. For most of the lead-free solders,paste handling
.. read more
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
In general,new lead-free solder alloys with the following characteristics are desired in order to enable the continuation of miniaturization trend: (1) alloy with a reduced melting temperature,
.. read more
Performing Flux-Technology for Pb-Free SN100C Solders
SN100C (Sn99Cu0.7 with Ni- and Ge-micro-additions) is a lead-free solder alloy that is finding increased acceptance globally and holds promise as a mainstream solution in terms of long-term sol
.. read more
Critical Cleaning of Highly Densed Electronic Assemblies in the Lead Free
An important development in high reliability electronics is the convergence of circuit board and advanced packaging technologies. This combination enhances the best attributes of each technolog
.. read more
The Lead-Free Wave Solder Process and Its Effect on Laminates
The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers
.. read more
The Lead-Free Wave Solder Process and Its Effect on Laminates
The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers
.. read more
Selection of Wave Soldering Fluxes for Lead Free Assembly
The process challenges of lead free wave soldering often require the use of new flux chemistries when compared with the
relatively tolerant tin-lead wave soldering process. In some cases,the fl
.. read more
Conquer Tombstoning in Lead-Free Soldering
Tombstoning of SnAgCu is affected by the solder composition. At vapor phase soldering,both wetting force and wetting
time at a temperature well above the melting point have no correlation with
.. read more
Low Surface Energy Coatings,Rewrites the Area Ratio Rules
Paste release characteristics are driven by the Area Ratio formula,which is based upon conventional stencil foil materials such as a variety of stainless steel alloys,nickel,etc. The surface en
.. read more
Cleaning PCBs in Electronics: Understanding today’s Needs
Because of the phase out of CFC’s and HCFC’s,standard solder pastes and fluxes evolved from RA and RMA fluxes,to No-Clean,to low residue No-Clean,to very low residue No-Clean. Many companies ca
.. read more
Defluxing for New Assembly Requirements
Consider defluxing at the design stage. This involves determining how product design may impact the assembly process. It also involves selecting the most effective,rugged defluxing option relat
.. read more
Lead-Free Flux Technology and Influence on Cleaning
Lead-free flux technology for electronic industry is mainly driven by high soldering temperature,high alloy surface tension, miniaturization,air soldering due to low cost consideration,and envi
.. read more
OA Flux Cleaning Studies on Highly Dense Advanced Packages Parameters
Cleaning flux residues post soldering has been a high reliability criterion practiced by assemblers of military,aerospace,automotive,medical devices and other value offerings. Highly dense adva
.. read more
Case Study – “Limitations of DI-Water Cleaning Processes”
While most cleaning processes in the global electronics manufacturing industry still rely on cleaning with DI-water only (for OA flux removal),recent studies suggest that water is beginning to
.. read more
Relationship Between Via Size and Cleanliness
Microvia technology has many advantages: it requires a smaller designed area,which saves the board size and weight,using less space,allowing for a smaller PCB,which can results in lower costs,a
.. read more
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
Flux technology for lead-free alloys differs considerably from that for eutectic Sn/Pb solder systems,mainly for soldering and cleaning purpose. For most of the lead-free solders,paste handling
.. read more
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
In general,new lead-free solder alloys with the following characteristics are desired in order to enable the continuation of miniaturization trend: (1) alloy with a reduced melting temperature,
.. read more
Performing Flux-Technology for Pb-Free SN100C Solders
SN100C (Sn99Cu0.7 with Ni- and Ge-micro-additions) is a lead-free solder alloy that is finding increased acceptance globally and holds promise as a mainstream solution in terms of long-term sol
.. read more
Critical Cleaning of Highly Densed Electronic Assemblies in the Lead Free
An important development in high reliability electronics is the convergence of circuit board and advanced packaging technologies. This combination enhances the best attributes of each technolog
.. read more
The Lead-Free Wave Solder Process and Its Effect on Laminates
The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers
.. read more
The Lead-Free Wave Solder Process and Its Effect on Laminates
The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers
.. read more
Selection of Wave Soldering Fluxes for Lead Free Assembly
The process challenges of lead free wave soldering often require the use of new flux chemistries when compared with the
relatively tolerant tin-lead wave soldering process. In some cases,the fl
.. read more
Conquer Tombstoning in Lead-Free Soldering
Tombstoning of SnAgCu is affected by the solder composition. At vapor phase soldering,both wetting force and wetting
time at a temperature well above the melting point have no correlation with
.. read more