Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Low Surface Energy Coatings,Rewrites the Area Ratio Rules

Paste release characteristics are driven by the Area Ratio formula,which is based upon conventional stencil foil materials such as a variety of stainless steel alloys,nickel,etc. The surface en .. read more

Atmospheric Plasma – A New Surface Treatment Technology for Cleaning PCBs

Low-pressure plasmas have been used for many years to surface clean and functionalize substrates prior to downstream converting operations; therefore,the benefits of plasma treatment are well r .. read more

The Feasibility of Blind Via on PTFE-FR4 Laminated Multi-Layer PCB

PTFE-FR4 hybrid laminated multi-layer PCB technology is being applied more and more widely. This technology requires blind via fabrication in a PTFE core. This paper gives a picture of the manu .. read more

PWB Final Surface Treatment Process and Film Characteristics that Satisfy Lead-free Solder Mounting

Because of environmental concerns,elimination of lead from electronic components has been recently encouraged,and as a result,lead-free solders are frequently adopted for solder mounting. The O .. read more

Low Surface Energy Coatings,Rewrites the Area Ratio Rules

Paste release characteristics are driven by the Area Ratio formula,which is based upon conventional stencil foil materials such as a variety of stainless steel alloys,nickel,etc. The surface en .. read more

Atmospheric Plasma – A New Surface Treatment Technology for Cleaning PCBs

Low-pressure plasmas have been used for many years to surface clean and functionalize substrates prior to downstream converting operations; therefore,the benefits of plasma treatment are well r .. read more

The Feasibility of Blind Via on PTFE-FR4 Laminated Multi-Layer PCB

PTFE-FR4 hybrid laminated multi-layer PCB technology is being applied more and more widely. This technology requires blind via fabrication in a PTFE core. This paper gives a picture of the manu .. read more

PWB Final Surface Treatment Process and Film Characteristics that Satisfy Lead-free Solder Mounting

Because of environmental concerns,elimination of lead from electronic components has been recently encouraged,and as a result,lead-free solders are frequently adopted for solder mounting. The O .. read more