Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

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Low Surface Energy Coatings,Rewrites the Area Ratio Rules

Paste release characteristics are driven by the Area Ratio formula,which is based upon conventional stencil foil materials such as a variety of stainless steel alloys,nickel,etc. The surface en .. read more

Performing Flux-Technology for Pb-Free SN100C Solders

SN100C (Sn99Cu0.7 with Ni- and Ge-micro-additions) is a lead-free solder alloy that is finding increased acceptance globally and holds promise as a mainstream solution in terms of long-term sol .. read more

Running Lead Free Reflow Profiles Without Nitrogen

The widespread use of SAC-based (SnAgCu) lead-free solder paste drives the industry toward reflow profiles that are considerably longer than those used for lead-bearing products. This is due to .. read more

Low Surface Energy Coatings,Rewrites the Area Ratio Rules

Paste release characteristics are driven by the Area Ratio formula,which is based upon conventional stencil foil materials such as a variety of stainless steel alloys,nickel,etc. The surface en .. read more

Performing Flux-Technology for Pb-Free SN100C Solders

SN100C (Sn99Cu0.7 with Ni- and Ge-micro-additions) is a lead-free solder alloy that is finding increased acceptance globally and holds promise as a mainstream solution in terms of long-term sol .. read more

Running Lead Free Reflow Profiles Without Nitrogen

The widespread use of SAC-based (SnAgCu) lead-free solder paste drives the industry toward reflow profiles that are considerably longer than those used for lead-bearing products. This is due to .. read more