Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Can 150μm Pitch Flip Chip be Done on Standard SMT Lines?
As miniaturization trends continue in the electronics industry, System in Package (SiP) technology is gaining more and more traction. In many ways, some SiP modules are just surface mount te
.. read more
Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology
The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC
Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (st
.. read more
PCB Assembly System Set-Up for Pop
Traditional SMT assembly is a two dimensional process. Each component is placed on the same horizontal plane in different
X and Y locations. In Package on Package (PoP) assembly,components are
.. read more
Fine Powder Solder Paste Applications for Semiconductor Packaging
Fine solder powder paste applications continue to grow as a cost effective solution to many semiconductor packaging needs. Applications for solder paste continue to evolve from the standard SMT
.. read more
System in Package: Identified Technology Needs from the 2994 iNEMI Roadmap
System in package (SiP) technology has grown significantly in the past several years. It was barely mentioned in the National
Electronics Manufacturing Initiative’s (NEMI’s) 2000 roadmap,but by
.. read more
Can 150μm Pitch Flip Chip be Done on Standard SMT Lines?
As miniaturization trends continue in the electronics industry, System in Package (SiP) technology is gaining more and more traction. In many ways, some SiP modules are just surface mount te
.. read more
Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology
The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC
Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (st
.. read more
PCB Assembly System Set-Up for Pop
Traditional SMT assembly is a two dimensional process. Each component is placed on the same horizontal plane in different
X and Y locations. In Package on Package (PoP) assembly,components are
.. read more
Fine Powder Solder Paste Applications for Semiconductor Packaging
Fine solder powder paste applications continue to grow as a cost effective solution to many semiconductor packaging needs. Applications for solder paste continue to evolve from the standard SMT
.. read more
System in Package: Identified Technology Needs from the 2994 iNEMI Roadmap
System in package (SiP) technology has grown significantly in the past several years. It was barely mentioned in the National
Electronics Manufacturing Initiative’s (NEMI’s) 2000 roadmap,but by
.. read more