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Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
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Dispensing Performances of Liquid Metal Alloys Containing Organic Compound Additives as Thermal Interface Materials for IC module Applications
Liquid metal alloys (LMAs), GaIn, and Galinstan, have been paid considerable attention as thermal interface materials (TIM) for usage of thermal management in microprocessor packages, includ
.. read more
Thermally Conductive, EMI Shielding Materials for High Frequency Radio Waves
Modern electronics are prone to experience electromagnetic interference (EMI) which hinders proper functioning of the devices due to the increasing number of wireless devices and the miniatu
.. read more
Silicone Migration Concerns in Thermal Materials – How Real are They?
Thermal interface materials (TIMs) are ubiquitous in electronics cooling in a wide variety of applications in industrial, automotive and consumer electronics [1]. These materials are typical
.. read more
Study Of Performance of Liquid Metal Containing Different Contents of Ag Particular Additives for Thermal Interface Materials
In the present research, we have studied the influence of Ag additives on wettability, adhesion, oxidation, viscosity and modulus of liquid metal on two alloys – Liquid Metal 1 (“LM1”) (62.5
.. read more
Thermally Conductive and Electrically Insulative Multi-functional Film Adhesives for Assembling High-power Density Devices
In many aerospace and defense systems, there are increasing demands for multi-functional adhesive solutions that not only fulfill the traditional role of component and assembly bonding, but
.. read more
Dispensing Performances of Liquid Metal Alloys Containing Organic Compound Additives as Thermal Interface Materials for IC module Applications
Liquid metal alloys (LMAs), GaIn, and Galinstan, have been paid considerable attention as thermal interface materials (TIM) for usage of thermal management in microprocessor packages, includ
.. read more
Thermally Conductive, EMI Shielding Materials for High Frequency Radio Waves
Modern electronics are prone to experience electromagnetic interference (EMI) which hinders proper functioning of the devices due to the increasing number of wireless devices and the miniatu
.. read more
Silicone Migration Concerns in Thermal Materials – How Real are They?
Thermal interface materials (TIMs) are ubiquitous in electronics cooling in a wide variety of applications in industrial, automotive and consumer electronics [1]. These materials are typical
.. read more
Study Of Performance of Liquid Metal Containing Different Contents of Ag Particular Additives for Thermal Interface Materials
In the present research, we have studied the influence of Ag additives on wettability, adhesion, oxidation, viscosity and modulus of liquid metal on two alloys – Liquid Metal 1 (“LM1”) (62.5
.. read more
Thermally Conductive and Electrically Insulative Multi-functional Film Adhesives for Assembling High-power Density Devices
In many aerospace and defense systems, there are increasing demands for multi-functional adhesive solutions that not only fulfill the traditional role of component and assembly bonding, but
.. read more