Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Enhanced Cleanability Using Fluxes with Decreased Viscosity after Reflow
A series of flux systems have been developed which would result in a reduced viscosity after reflow. This enables a high viscosity, high tack flux to be used to secure components at the comp
.. read more
Investigation of Process Feasibility / Compatibility and Solder Joint Reliability of Tin-Lead Dippable Solder Paste Ball Grid Array (BGA) Component...
This paper is an examination of the process feasibility,solder joint reliability,and materials/process compatibility of a dippable solder paste material for an area array component rework/repai
.. read more
Determining the Reliability of Tacky Fluxes in Varying Soldering Applications
The use of tacky fluxes is common throughout the industry in applications such as ball attach,BGA repair and hand soldering. These applications employ different heating profiles,meaning that th
.. read more
Chip Scale Package and Flip Chip Assembly Using Tacky Flux
Application of solder paste by using stencil-printing process is a commonly used method for high volume electronics circuits manufacturing. This process has proved to be the fastest and most co
.. read more
Enhanced Cleanability Using Fluxes with Decreased Viscosity after Reflow
A series of flux systems have been developed which would result in a reduced viscosity after reflow. This enables a high viscosity, high tack flux to be used to secure components at the comp
.. read more
Investigation of Process Feasibility / Compatibility and Solder Joint Reliability of Tin-Lead Dippable Solder Paste Ball Grid Array (BGA) Component...
This paper is an examination of the process feasibility,solder joint reliability,and materials/process compatibility of a dippable solder paste material for an area array component rework/repai
.. read more
Determining the Reliability of Tacky Fluxes in Varying Soldering Applications
The use of tacky fluxes is common throughout the industry in applications such as ball attach,BGA repair and hand soldering. These applications employ different heating profiles,meaning that th
.. read more
Chip Scale Package and Flip Chip Assembly Using Tacky Flux
Application of solder paste by using stencil-printing process is a commonly used method for high volume electronics circuits manufacturing. This process has proved to be the fastest and most co
.. read more