Knowledge Hub
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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Evaluating the Accuracy of a Nondestructive Thermo Couple Attach Method for Area Array Package Profiling
The oven recipe,which consists of the reflow oven zone temperature settings and the speed of the conveyor,will determine a specific time-temperature profile for a given PCB assembly. In order t
.. read more
An Issue in Time to Delamination (T260) Testing for PCBs
It has been reported by several laboratories that the time to delamination or decomposition of a printed circuit board specimen
at 260°C decreases with the specimen thickness. A temperature gra
.. read more
Evaluating the Accuracy of a Nondestructive Thermo Couple Attach Method for Area Array Package Profiling
The oven recipe,which consists of the reflow oven zone temperature settings and the speed of the conveyor,will determine a specific time-temperature profile for a given PCB assembly. In order t
.. read more
An Issue in Time to Delamination (T260) Testing for PCBs
It has been reported by several laboratories that the time to delamination or decomposition of a printed circuit board specimen
at 260°C decreases with the specimen thickness. A temperature gra
.. read more