Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305
An In-containing mid-temperature solder paste (MTS) has been developed and successfully used in mobile phone board-stack soldering with a 200°C peak temperature profile [1]. It is now being
.. read more
Oxidation Resistant Nano-Cu Sintering Paste for Die Attach Applications
A nano-Cu pressureless sinterable paste was developed for joint formation applications. The material was further engineered in both chemistry and process for enhanced oxidation resistance. T
.. read more
A Novel Bi-Free Low Temperature Solder Paste with Outstanding Drop Shock Resistance
DurafuseTM LT paste was designed as an alternative low temperature solder targeting at enabling hierarchy design for portable devices with good temperature cycling and superior drop-shock pe
.. read more
Embedded Components: A Comparative Analysis of Reliability Part II
In light of new process and product technologies in the field of embedded components,questions arise with respect to advantages and potential disadvantages to standard SMT component placement w
.. read more
Reliability Performance of Very Thin Printed Circuit Boards with regard to Different any-Layer Manufacturing Technologies
The next generation of smart phones will demand very thin multi-layer boards to reduce the product thickness again. This paper shows three different manufacturing approaches,which can be used f
.. read more
SMT Manufacturability and Reliability in PCB Cavities
Considering technological advances in multi-depth cavities in the PCB manufacturing industry,various subtopics have materialized regarding the processing and application of such features in dev
.. read more
Embedded Components: A Comparative Analysis of Reliability
In light of new process and product technologies in the field of embedded components,questions arise with respect to
advantages and potential disadvantages to standard SMT component placement w
.. read more
A Novel Primer Coating on Organic Substrate for Reliable Inkjet Printed Circuit
Even though ink jet printed circuit has many advantages over typical subtractive PWB technology such as fewer processes,less waste and labor,it has some problems. A major problem is weak adhesi
.. read more
Thermal Cycle Testing of PWBs – Methodology
Reliability testing of printed wire boards (PWBs) by thermal cycling offers the ability to compare relative survivability through assembly and reliability in the end use environment. This artic
.. read more
Performance of Photoimageable Solder Masks – A Study on Thermal Stress
The continuous temperature resistance of electrically insulating materials can be judged by examining the effect of thermal stress loads on the electrical properties,such as moisture and insula
.. read more
The Whisker Growth Investigation of IC Packaging on the PC Board Assembly
The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in
.. read more
On Solder Joints Reliability and Component Damage of Hand Soldered Lead-Free PTH and SMD Components
Due to the European legislations (RoHS and WEEE) consumer products need to be soldered with lead-free solders from the first of July 2006. Since several properties (physical,chemical,mechanical
.. read more
A Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305
An In-containing mid-temperature solder paste (MTS) has been developed and successfully used in mobile phone board-stack soldering with a 200°C peak temperature profile [1]. It is now being
.. read more
Oxidation Resistant Nano-Cu Sintering Paste for Die Attach Applications
A nano-Cu pressureless sinterable paste was developed for joint formation applications. The material was further engineered in both chemistry and process for enhanced oxidation resistance. T
.. read more
A Novel Bi-Free Low Temperature Solder Paste with Outstanding Drop Shock Resistance
DurafuseTM LT paste was designed as an alternative low temperature solder targeting at enabling hierarchy design for portable devices with good temperature cycling and superior drop-shock pe
.. read more
Embedded Components: A Comparative Analysis of Reliability Part II
In light of new process and product technologies in the field of embedded components,questions arise with respect to advantages and potential disadvantages to standard SMT component placement w
.. read more
Reliability Performance of Very Thin Printed Circuit Boards with regard to Different any-Layer Manufacturing Technologies
The next generation of smart phones will demand very thin multi-layer boards to reduce the product thickness again. This paper shows three different manufacturing approaches,which can be used f
.. read more
SMT Manufacturability and Reliability in PCB Cavities
Considering technological advances in multi-depth cavities in the PCB manufacturing industry,various subtopics have materialized regarding the processing and application of such features in dev
.. read more
Embedded Components: A Comparative Analysis of Reliability
In light of new process and product technologies in the field of embedded components,questions arise with respect to
advantages and potential disadvantages to standard SMT component placement w
.. read more
A Novel Primer Coating on Organic Substrate for Reliable Inkjet Printed Circuit
Even though ink jet printed circuit has many advantages over typical subtractive PWB technology such as fewer processes,less waste and labor,it has some problems. A major problem is weak adhesi
.. read more
Thermal Cycle Testing of PWBs – Methodology
Reliability testing of printed wire boards (PWBs) by thermal cycling offers the ability to compare relative survivability through assembly and reliability in the end use environment. This artic
.. read more
Performance of Photoimageable Solder Masks – A Study on Thermal Stress
The continuous temperature resistance of electrically insulating materials can be judged by examining the effect of thermal stress loads on the electrical properties,such as moisture and insula
.. read more
The Whisker Growth Investigation of IC Packaging on the PC Board Assembly
The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in
.. read more
On Solder Joints Reliability and Component Damage of Hand Soldered Lead-Free PTH and SMD Components
Due to the European legislations (RoHS and WEEE) consumer products need to be soldered with lead-free solders from the first of July 2006. Since several properties (physical,chemical,mechanical
.. read more