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iNEMI HFR-Free PCB Materials Team Project: An Investigation to Identify Technology Limitations Involved in Transitioning to HFR-Free PCB Materials
In response to a growing concern within the Electronic Industry to the transition to Halogen-Free laminates (HFR-Free)
within the Client Market space (Desktop and Notebook computers) iNEMI init
.. read more
A Combination Flame Retardant Curing Agent Material For Non-Halogen PCB Laminates
As interest continues in the development of non-halogen flame retardants for printed circuit boards,the requirements for robust thermal stability and lead-free solder compatibility also continu
.. read more
Toughened Laminates for Printed Circuit Boards: Correlation of Drillability to Material Properties
With the miniaturization of electronic devices1,the need for more versatile materials to make these devices increases. Coupled with the gradual removal of lead-based solders2,thermal stability
.. read more
Impact of Moisture Content on Printed Circuit Board Laminate Thermal Properties
Moisture plays an important role in the integrity and reliability of printed circuit boards (PCBs). The presence of moisture in a PCB alters its thermo-mechanical properties,induces hygroscopic
.. read more
A Novel Halogen-Free Material for High Speed PCB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. read more
The Influence of Material Reactivity in Dk/Df Electrical Performance
Over the years,signal integrity performance and bandwidth gets more critical for today’s higher signal transmission speeds and bandwidth demand in every field of applications such as computing,
.. read more
Effect of Lead-free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates
The high temperature exposures associated with lead-free soldering of printed circuit boards (PCBs) can alter the laminate
material properties thereby creating a shift in the performance and re
.. read more
Novel Low Dk/Df Materials for High Speed PWB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. read more
More Robust Base Materials for Electronic Assemblies
The proposed revision of IPC-4101 - Specification for Base Materials for Rigid and Multilayer Printed Boards contains new
slash sheets describing FR-4 base materials compatible with lead free a
.. read more
LOWERING LAYERS w/HDI for RoHS ROBUSTNESS
A perplexing challenge for RoHS compliance is adapting large,complex and thick,high-layer count multilayers to lead-free assembly. These are typically dense,complex assemblies with large BGAs a
.. read more
Lead Free Soldering: Impact on Laminates Requirements
Different legislations or draft directives target the restriction or the ban of the use of lead in the world. The law banning
lead-bearing electronic products (with a few exemptions) in the Eur
.. read more
Characterization of the Thermal Stability of Electrical Laminates Suitable for Lead-Free Soldering
Lead-free soldering is expected to become the new standard in the future. Different legislations or draft directives target the restriction or the ban of the use of lead in the world. As an exa
.. read more
iNEMI HFR-Free PCB Materials Team Project: An Investigation to Identify Technology Limitations Involved in Transitioning to HFR-Free PCB Materials
In response to a growing concern within the Electronic Industry to the transition to Halogen-Free laminates (HFR-Free)
within the Client Market space (Desktop and Notebook computers) iNEMI init
.. read more
A Combination Flame Retardant Curing Agent Material For Non-Halogen PCB Laminates
As interest continues in the development of non-halogen flame retardants for printed circuit boards,the requirements for robust thermal stability and lead-free solder compatibility also continu
.. read more
Toughened Laminates for Printed Circuit Boards: Correlation of Drillability to Material Properties
With the miniaturization of electronic devices1,the need for more versatile materials to make these devices increases. Coupled with the gradual removal of lead-based solders2,thermal stability
.. read more
Impact of Moisture Content on Printed Circuit Board Laminate Thermal Properties
Moisture plays an important role in the integrity and reliability of printed circuit boards (PCBs). The presence of moisture in a PCB alters its thermo-mechanical properties,induces hygroscopic
.. read more
A Novel Halogen-Free Material for High Speed PCB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. read more
The Influence of Material Reactivity in Dk/Df Electrical Performance
Over the years,signal integrity performance and bandwidth gets more critical for today’s higher signal transmission speeds and bandwidth demand in every field of applications such as computing,
.. read more
Effect of Lead-free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates
The high temperature exposures associated with lead-free soldering of printed circuit boards (PCBs) can alter the laminate
material properties thereby creating a shift in the performance and re
.. read more
Novel Low Dk/Df Materials for High Speed PWB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. read more
More Robust Base Materials for Electronic Assemblies
The proposed revision of IPC-4101 - Specification for Base Materials for Rigid and Multilayer Printed Boards contains new
slash sheets describing FR-4 base materials compatible with lead free a
.. read more
LOWERING LAYERS w/HDI for RoHS ROBUSTNESS
A perplexing challenge for RoHS compliance is adapting large,complex and thick,high-layer count multilayers to lead-free assembly. These are typically dense,complex assemblies with large BGAs a
.. read more
Lead Free Soldering: Impact on Laminates Requirements
Different legislations or draft directives target the restriction or the ban of the use of lead in the world. The law banning
lead-bearing electronic products (with a few exemptions) in the Eur
.. read more
Characterization of the Thermal Stability of Electrical Laminates Suitable for Lead-Free Soldering
Lead-free soldering is expected to become the new standard in the future. Different legislations or draft directives target the restriction or the ban of the use of lead in the world. As an exa
.. read more