Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Evaluation of Transient Phase Conductive Material and Copper PCB Construction
Traditional PCB fabrication technology incorporates copper-plated vias after each press lamination connecting with microvias or mechanical vias. Conductive epoxy or transient phase conductiv
.. read more
A Study of PCB Insertion Loss Variation in Manufacturing Using a New Low Cost Metrology
Signal integrity analysis has shown that printed circuit board (PCB) insertion loss is a key factor affecting high
speed channel performance. Determining and controlling PCB insertion loss have
.. read more
Next Generation Test Methodologies and Analysis for Physical Layer Structures
Printed circuit board (PCB) material properties and surface roughness directly influence attenuation and NEXT/FEXT crosstalk signal integrity of high speed digital interconnect design. Balancin
.. read more
HDPUG Pb-Free Board Materials Reliability Project 2 Moisture Sensitivity and Its Effect on Delamination
As part of High Density Packaging Users Group (HDPUG) Pb-Free Board Materials Reliability Project 2,the moisture sensitivity of various lead-free laminates and the effect of moisture uptake on
.. read more
Transmission Line Characterization through the Enhanced Root Impulse Energy Loss
In today’s PCB industry,the challenges are no longer just on how to control and improve the manufacturing
processes,but also to ensure the fabricated product is compliant to the industry standa
.. read more
PCB Board Design Considerations for Impedance Control and Optimal Signal Integrity in High Speed Digital and RF Systems
For the electronics on PCB’s,dielectric materials provide not only material and media support for the high-speed digital and RF systems,but also electrical performance. Impedance control and si
.. read more
Assessment of Moisture Content Measurement Methods for Printed Circuit Boards
Using embedded structures in printed circuit boards,changes in moisture content have been monitored using route-impulse-energy measurement,capacitance measurement and weight gain. All three met
.. read more
Comparative Analysis of Solder Joint Degradation Using RF Impedance and Event Detectors
Under cycling loading conditions,solder joints are susceptible to fatigue cracking,which often initiates at the surface where the strain range is maximized. Event detectors have been widely use
.. read more
Changing the Paradigm For Optical and X-Ray Inspection of Backplanes and Large PCB Assemblies
Fully automatic X-ray Inspection (AXI) is an established technique for inspecting component mounting and solder joint integrity on PCBA’s. It is occasionally used for the detection of faults on
.. read more
Effects of Adhesion Promotion Treatment On Electrical Signal Attenuation
Oxide alternatives,as well as traditional and reduced oxide chemistries,are coatings or “adhesion promoters” used to enhance the bond between imaged and etched inner layer copper surfaces and t
.. read more
Production Test Methodology to Determine High Frequency Signal Loss of PWB
A new low cost,simple and repeatable production test method for measuring signal loss of printed wiring board (PWB) interconnects is discussed. The method uses Time Domain Reflectometry (TDR) t
.. read more
Low Cost Energy Based TDR Loss Method for PWB Manufacturers
While silicon density doubles approximately every 18 months,following Moore’s law,PWB electrical technology advances much more slowly,Up until now trace impedance has been a sufficient high spe
.. read more
Optimal PCB Test Trace Design for Improved Quality Control
A common industry practice is to confirm the characteristic impedance of critical PCB traces meet specified performance
tolerances before any components are attached. A popular technique is to
.. read more
Propagation Delay Measurements with TDR in the Manufacturing Environment
This paper addresses the growing need in the Printed Wiring Board industry to measure and test propagation delay
parameters of board interconnects within the fabrication process. The state of c
.. read more
Evaluation of Transient Phase Conductive Material and Copper PCB Construction
Traditional PCB fabrication technology incorporates copper-plated vias after each press lamination connecting with microvias or mechanical vias. Conductive epoxy or transient phase conductiv
.. read more
A Study of PCB Insertion Loss Variation in Manufacturing Using a New Low Cost Metrology
Signal integrity analysis has shown that printed circuit board (PCB) insertion loss is a key factor affecting high
speed channel performance. Determining and controlling PCB insertion loss have
.. read more
Next Generation Test Methodologies and Analysis for Physical Layer Structures
Printed circuit board (PCB) material properties and surface roughness directly influence attenuation and NEXT/FEXT crosstalk signal integrity of high speed digital interconnect design. Balancin
.. read more
HDPUG Pb-Free Board Materials Reliability Project 2 Moisture Sensitivity and Its Effect on Delamination
As part of High Density Packaging Users Group (HDPUG) Pb-Free Board Materials Reliability Project 2,the moisture sensitivity of various lead-free laminates and the effect of moisture uptake on
.. read more
Transmission Line Characterization through the Enhanced Root Impulse Energy Loss
In today’s PCB industry,the challenges are no longer just on how to control and improve the manufacturing
processes,but also to ensure the fabricated product is compliant to the industry standa
.. read more
PCB Board Design Considerations for Impedance Control and Optimal Signal Integrity in High Speed Digital and RF Systems
For the electronics on PCB’s,dielectric materials provide not only material and media support for the high-speed digital and RF systems,but also electrical performance. Impedance control and si
.. read more
Assessment of Moisture Content Measurement Methods for Printed Circuit Boards
Using embedded structures in printed circuit boards,changes in moisture content have been monitored using route-impulse-energy measurement,capacitance measurement and weight gain. All three met
.. read more
Comparative Analysis of Solder Joint Degradation Using RF Impedance and Event Detectors
Under cycling loading conditions,solder joints are susceptible to fatigue cracking,which often initiates at the surface where the strain range is maximized. Event detectors have been widely use
.. read more
Changing the Paradigm For Optical and X-Ray Inspection of Backplanes and Large PCB Assemblies
Fully automatic X-ray Inspection (AXI) is an established technique for inspecting component mounting and solder joint integrity on PCBA’s. It is occasionally used for the detection of faults on
.. read more
Effects of Adhesion Promotion Treatment On Electrical Signal Attenuation
Oxide alternatives,as well as traditional and reduced oxide chemistries,are coatings or “adhesion promoters” used to enhance the bond between imaged and etched inner layer copper surfaces and t
.. read more
Production Test Methodology to Determine High Frequency Signal Loss of PWB
A new low cost,simple and repeatable production test method for measuring signal loss of printed wiring board (PWB) interconnects is discussed. The method uses Time Domain Reflectometry (TDR) t
.. read more
Low Cost Energy Based TDR Loss Method for PWB Manufacturers
While silicon density doubles approximately every 18 months,following Moore’s law,PWB electrical technology advances much more slowly,Up until now trace impedance has been a sufficient high spe
.. read more
Optimal PCB Test Trace Design for Improved Quality Control
A common industry practice is to confirm the characteristic impedance of critical PCB traces meet specified performance
tolerances before any components are attached. A popular technique is to
.. read more
Propagation Delay Measurements with TDR in the Manufacturing Environment
This paper addresses the growing need in the Printed Wiring Board industry to measure and test propagation delay
parameters of board interconnects within the fabrication process. The state of c
.. read more