Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A Microvia Damage Model
An electrical model of a thermally damaged microvia has been constructed incorporating observations from electrical test, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy
.. read more
High Resolution Physical Analyses of Microvia - Target Pad Interfaces
Open circuit failure in microvias is an important issue for critical device reliability yet remains poorly understood. Separations at the microvia-target pad interface caused by board-normal
.. read more
Impregnation of Metal Complex into Epoxy Insulation Materials Using Supercritical Carbon Dioxide and Its Application for Copper Plating
Metal plating of epoxy polymer has been widely applied for industrial products for a long time,especially in the field of Printed Circuit Boards (PCB’s). This technique is one of the most impor
.. read more
Electrodeposited Nanocrystalline Copper for Printed Wiring Board Applications
Nanocrystalline and ultra-fine grain copper can potentially offer increased reliability and functionality of printed wiring
boards due to expected enhancements in strength and achievable wiring
.. read more
IMC Growth Study on Ni-P/Pd/Au Film and Ni-P/Au Film Using Sn/Ag/Cu Lead Free Solder
The surface finishes Ni-P/Pd/Au (hereafter referred to ENEPIG) and Ni-P/Au (hereafter referred to ENIG) were
prepared on ball grid array (BGA) circuit boards by electroless/immersion plating me
.. read more
A Microvia Damage Model
An electrical model of a thermally damaged microvia has been constructed incorporating observations from electrical test, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy
.. read more
High Resolution Physical Analyses of Microvia - Target Pad Interfaces
Open circuit failure in microvias is an important issue for critical device reliability yet remains poorly understood. Separations at the microvia-target pad interface caused by board-normal
.. read more
Impregnation of Metal Complex into Epoxy Insulation Materials Using Supercritical Carbon Dioxide and Its Application for Copper Plating
Metal plating of epoxy polymer has been widely applied for industrial products for a long time,especially in the field of Printed Circuit Boards (PCB’s). This technique is one of the most impor
.. read more
Electrodeposited Nanocrystalline Copper for Printed Wiring Board Applications
Nanocrystalline and ultra-fine grain copper can potentially offer increased reliability and functionality of printed wiring
boards due to expected enhancements in strength and achievable wiring
.. read more
IMC Growth Study on Ni-P/Pd/Au Film and Ni-P/Au Film Using Sn/Ag/Cu Lead Free Solder
The surface finishes Ni-P/Pd/Au (hereafter referred to ENEPIG) and Ni-P/Au (hereafter referred to ENIG) were
prepared on ball grid array (BGA) circuit boards by electroless/immersion plating me
.. read more