Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Does Thermal Cycling Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue

No-clean solder pastes are widely used in a number of applications that are exposed to wide variations in temperature during the life of the assembled electronics device. Some have observed tha .. read more

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Lead Free Die Attach Technology for High Power Applications

TLPS materials are an attractive alternative to PbSn for IC power device packaging. They provide a low VOC composition,lead free die attach solution that meets the RoHS guidelines. TLPS materia .. read more

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Solder Charge Grid Array: Advancements in the Technology of Surface Mount Area Array Solder Joint Attachment

Surface mount area arrays (SMAA) have been in existence for decades and are increasingly becoming more important as printed circuit board (PCB) assemblies become further complex with package mi .. read more

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Effects of Tin Mitigation Processes on Whisker Growth and Solder Joint Reliability for Chip and Small-Outline Package Components

This paper reports the results of an evaluation of tin mitigation processes for components,i.e. converting parts with pure tin (Sn) and other lead-free (Pb-free) finishes to tin-lead (SnPb) fin .. read more

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The Effects of Tin Whisker Testing on Solder Connections

The RoHS legislation in Europe has far reaching consequences,which necessitates a change in lead coating on component leads. Although some suppliers are using a tin finish,there is a tendency f .. read more

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A Method to Evaluate PCBA Suppliers’ Pb Free vs. Leaded Processes for Telecom

The purpose of this program was to evaluate the solder joint reliability,using the IPC-9701 standard as a guideline,of PCBAs that were assembled with conventional leaded and ROHS compliant lead .. read more

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Tin Whisker Growth - Substrate Effect Understanding CTE Mismatch and IMC Formation

The hypothesis that the “whisker growth phenomenon” in electrodeposited tin is a re-crystallization process driven by stress has gained popularity among leading research institutes and industri .. read more

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HDPUG's Design for Lead-Free Solder Joint Reliability of High-Density Packages

The lead-free solder-joint reliability of the high-density packages,256-pin PBGA (plastic ball grid array),388-pin PBGA,and 1657-pin CCGA (ceramic column grid array),on PCB (printed circuit boa .. read more

HDPUG's Reliability Testing and Data Analysis of High-Density Packages Lead-Free Solder Joints

Temperature cycling test and statistical analysis of various high-density packages on PCBs with SnCu HASL,NiAu, and OSP finishes are investigated in this study. Emphasis is placed on the determ .. read more

Solder Joint Thermal Fatigue Damage Evaluation by a Simplified Method

In the present study,a simplified analysis methodology is used to evaluate thermal fatigue damage of solder joints of a leadless ceramic chip carrier (LCCC) or a leadless chip capacitor/resisto .. read more

Microvia PWB's Qualified for Avionics,Microvias Can Enhance PWB Reliability

Laser-drilled microvias are being added to the list of approved technologies for printed wiring boards destined for use in a rapidly increasing number of application types and environments. Mic .. read more

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