Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Next Generation Test Methodologies and Analysis for Physical Layer Structures
Printed circuit board (PCB) material properties and surface roughness directly influence attenuation and NEXT/FEXT crosstalk signal integrity of high speed digital interconnect design. Balancin
.. read more
Performance of Photoimageable Solder Masks – A Study on Thermal Stress
The continuous temperature resistance of electrically insulating materials can be judged by examining the effect of thermal stress loads on the electrical properties,such as moisture and insula
.. read more
Production Test Methodology to Determine High Frequency Signal Loss of PWB
A new low cost,simple and repeatable production test method for measuring signal loss of printed wiring board (PWB) interconnects is discussed. The method uses Time Domain Reflectometry (TDR) t
.. read more
The Integration of Third-Party Boundary-Scan Products into Customer Preferred Test Platforms has Become and Attractive Cost Effective Test Solution
In today’s complex manufacturing test environments,it is becoming increasingly difficult to detect and diagnose structural
faults within highly complex multi-layer PCB designs that offer extrem
.. read more
Next Generation Test Methodologies and Analysis for Physical Layer Structures
Printed circuit board (PCB) material properties and surface roughness directly influence attenuation and NEXT/FEXT crosstalk signal integrity of high speed digital interconnect design. Balancin
.. read more
Performance of Photoimageable Solder Masks – A Study on Thermal Stress
The continuous temperature resistance of electrically insulating materials can be judged by examining the effect of thermal stress loads on the electrical properties,such as moisture and insula
.. read more
Production Test Methodology to Determine High Frequency Signal Loss of PWB
A new low cost,simple and repeatable production test method for measuring signal loss of printed wiring board (PWB) interconnects is discussed. The method uses Time Domain Reflectometry (TDR) t
.. read more
The Integration of Third-Party Boundary-Scan Products into Customer Preferred Test Platforms has Become and Attractive Cost Effective Test Solution
In today’s complex manufacturing test environments,it is becoming increasingly difficult to detect and diagnose structural
faults within highly complex multi-layer PCB designs that offer extrem
.. read more