Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Exploring the Performance of Silicone Gels at High and Low Temperature
Silicones have been used in the electronics industry as protective/assembly materials for operations that will have a wide temperature variation. A large variety of silicone products are availa
.. read more
A Combination Flame Retardant Curing Agent Material For Non-Halogen PCB Laminates
As interest continues in the development of non-halogen flame retardants for printed circuit boards,the requirements for robust thermal stability and lead-free solder compatibility also continu
.. read more
Impact of Moisture Content on Printed Circuit Board Laminate Thermal Properties
Moisture plays an important role in the integrity and reliability of printed circuit boards (PCBs). The presence of moisture in a PCB alters its thermo-mechanical properties,induces hygroscopic
.. read more
Estimating Stencil Life and Ideal Heating Profile of Solder Paste Using Advanced Thermo-Gravimetric Analysis
Thermo-gravimetric Analysis (TGA) measures weight changes in a material as a function of temperature (or time) under a controlled atmosphere. This technique is currently used in the design phas
.. read more
Performing Flux-Technology for Pb-Free SN100C Solders
SN100C (Sn99Cu0.7 with Ni- and Ge-micro-additions) is a lead-free solder alloy that is finding increased acceptance globally and holds promise as a mainstream solution in terms of long-term sol
.. read more
Novel Low Dk/Df Materials for High Speed PWB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. read more
Describing Key Coating and Process Characteristics of a Pb-Free OSP Process
Organic Solderability Preservatives (OSP) continue to attract significant attention as circuit board final finishes. They have evolved from simple and thin benzotriazole coatings to thicker and
.. read more
Lead Free Processing and other Thermal Challenges for Flexible Printed Circuits
In this paper,factors that influence the ability for a flex circuit,especially a multilayer flex circuit,to survive the lead-free soldering and other thermal processes during the circuit fabric
.. read more
Lead Free Assembly Impacts on Laminate Material Properties and “Pad Crater” Failures
Printed circuit board (PCB) feature sizes are decreasing to support increasing density thrusts for electronic products and packaging. The transition to lead-free products has changed the stress
.. read more
Sublimation of Two Dicarboxylic Acids Used in Solder Pastes
Our industry is slowly coming to the realization that many fluxes containing low molecular weight carboxylic acids cannot be adequately tested for surface insulation resistance and electrochemi
.. read more
Novel High Temperature Resistant OSP Coatings for Lead-free Processing
In order to meet the growing requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is migrating from hot-air-leveled solder (Sn/Pb) to lead free compatible al
.. read more
Lead Free Soldering: Impact on Laminates Requirements
Different legislations or draft directives target the restriction or the ban of the use of lead in the world. The law banning
lead-bearing electronic products (with a few exemptions) in the Eur
.. read more
The Characterization of Novel High Temperature Resistant OSP Coatings for Lead free Processes by Comparing to Other Commercial OSP Coatings
In order to meet the growing requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is
migrating from hot-air-leveled solder (Sn/Pb) to lead free compatible al
.. read more
Characterization of the Thermal Stability of Electrical Laminates Suitable for Lead-Free Soldering
Lead-free soldering is expected to become the new standard in the future. Different legislations or draft directives target the restriction or the ban of the use of lead in the world. As an exa
.. read more
Application of Thermal Analysis Techniques to Determine Performance Entitlement of Base Materials through Assembly
Multiple soldering assembly steps are essentially
standard for PWBs based on current technologies and
needs. A variety of tests are currently in use to
evaluate the performance of finished PWBs
.. read more
Exploring the Performance of Silicone Gels at High and Low Temperature
Silicones have been used in the electronics industry as protective/assembly materials for operations that will have a wide temperature variation. A large variety of silicone products are availa
.. read more
A Combination Flame Retardant Curing Agent Material For Non-Halogen PCB Laminates
As interest continues in the development of non-halogen flame retardants for printed circuit boards,the requirements for robust thermal stability and lead-free solder compatibility also continu
.. read more
Impact of Moisture Content on Printed Circuit Board Laminate Thermal Properties
Moisture plays an important role in the integrity and reliability of printed circuit boards (PCBs). The presence of moisture in a PCB alters its thermo-mechanical properties,induces hygroscopic
.. read more
Estimating Stencil Life and Ideal Heating Profile of Solder Paste Using Advanced Thermo-Gravimetric Analysis
Thermo-gravimetric Analysis (TGA) measures weight changes in a material as a function of temperature (or time) under a controlled atmosphere. This technique is currently used in the design phas
.. read more
Performing Flux-Technology for Pb-Free SN100C Solders
SN100C (Sn99Cu0.7 with Ni- and Ge-micro-additions) is a lead-free solder alloy that is finding increased acceptance globally and holds promise as a mainstream solution in terms of long-term sol
.. read more
Novel Low Dk/Df Materials for High Speed PWB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. read more
Describing Key Coating and Process Characteristics of a Pb-Free OSP Process
Organic Solderability Preservatives (OSP) continue to attract significant attention as circuit board final finishes. They have evolved from simple and thin benzotriazole coatings to thicker and
.. read more
Lead Free Processing and other Thermal Challenges for Flexible Printed Circuits
In this paper,factors that influence the ability for a flex circuit,especially a multilayer flex circuit,to survive the lead-free soldering and other thermal processes during the circuit fabric
.. read more
Lead Free Assembly Impacts on Laminate Material Properties and “Pad Crater” Failures
Printed circuit board (PCB) feature sizes are decreasing to support increasing density thrusts for electronic products and packaging. The transition to lead-free products has changed the stress
.. read more
Sublimation of Two Dicarboxylic Acids Used in Solder Pastes
Our industry is slowly coming to the realization that many fluxes containing low molecular weight carboxylic acids cannot be adequately tested for surface insulation resistance and electrochemi
.. read more
Novel High Temperature Resistant OSP Coatings for Lead-free Processing
In order to meet the growing requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is migrating from hot-air-leveled solder (Sn/Pb) to lead free compatible al
.. read more
Lead Free Soldering: Impact on Laminates Requirements
Different legislations or draft directives target the restriction or the ban of the use of lead in the world. The law banning
lead-bearing electronic products (with a few exemptions) in the Eur
.. read more
The Characterization of Novel High Temperature Resistant OSP Coatings for Lead free Processes by Comparing to Other Commercial OSP Coatings
In order to meet the growing requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is
migrating from hot-air-leveled solder (Sn/Pb) to lead free compatible al
.. read more
Characterization of the Thermal Stability of Electrical Laminates Suitable for Lead-Free Soldering
Lead-free soldering is expected to become the new standard in the future. Different legislations or draft directives target the restriction or the ban of the use of lead in the world. As an exa
.. read more
Application of Thermal Analysis Techniques to Determine Performance Entitlement of Base Materials through Assembly
Multiple soldering assembly steps are essentially
standard for PWBs based on current technologies and
needs. A variety of tests are currently in use to
evaluate the performance of finished PWBs
.. read more