Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Liquid Metal Enabled Soft and Stretchable Electronics
This paper summarizes recent progress on utilizing liquid metals (LMs) consisting of gallium and gallium alloys for the electronics industry. While gallium is a component of existing electro
.. read more
Thermally Conductive Polymeric Material (TCPM)
The electronics industry is seeing more data being computed through printed circuit boards (PCBs). For example, to support 5G communications, most electronics will need to increase their pro
.. read more
Electro-Thermal-Mechanical Modeling of one-Dimensional Conductors, Whiskers, and Wires Including Convection, and Considering Tin, Bismuth, Zinc And Indium
This work provides analytical solutions to the temperature rise of one-dimensional conductors such as whiskers and wires. Whisker growth from metal surfaces of electrical connectors and othe
.. read more
Thermal Materials for Packaging Power Electronics
Power electronics based on silicon devices must operate below 125 C and IGBTs under 150 C - WBG devices could extend this to 200 C. Thermal management of power electronics, whether power sup
.. read more
Solid Liquid Hybrid TIMs
For many years, metals have been used as thermal interface materials (TIMs) in the electronics industry. With high reliability and high thermal conductivity, metals have been a great solutio
.. read more
Thermal Improvement in 3D Embedded Modules Using Copper Bar Vias
The combination of increased I/O density, reduced footprint, and multi-die capability within a single platform makes embedded die an attractive solution. The benefits of embedding active die
.. read more
Novel TIM Solution with Chain Network Solder Composite
A novel epoxy SAC solder paste TIM system has been developedwith the use of non-volatile epoxy flux. Cu filler was added to the solder paste, with Cu volume % of metal ranged from 17 to 60 v
.. read more
Filling of Microvias and Through Holes by Electrolytic Copper Plating - Current Status and Future Outlook
The electronics industry is further progressing in terms of smaller,faster,smarter and more efficient electronic devices. This continuous evolving environment caused the development on various
.. read more
Laser-Based Methodology for the Application of Glass as a Dielectric and Cu Pattern Carrier for Printed Circuit Boards
Glass offers a number of advantages as a dielectric material,such as a low coefficient of thermal expansion (CTE),high dimensional stability,high thermal conductivity and suitable dielectric co
.. read more
Controlling Voiding Mechanisms in the Reflow Soldering Process
While a significant level of voiding can be tolerated in solder joints where electrical conductivity is the main requirement,voiding at any level severely compromises thermal conductivity. For
.. read more
Novel Thermally Conductive Low Pressure Overmold Materials as a Solution for Thermal Management
The dissipation of heat from a power die,such as those used to drive the increasingly popular LED arrays,has traditionally been achieved by use of a thermal interface material (TIM) and a metal
.. read more
Low Temperature Alloy Development for Electronics Assembly
New Low Temp. Alloys were developed,through elemental additions,to improve mechanical strength,fatigue life and drop shock resistance.
•Effect of these elemental additions on the new alloys was
.. read more
Thermal Characteristics of PCB Laminates used in High Frequency Applications
As technology advances,understanding thermal management issues of high frequency PCB’s increases. There are many different aspects to consider for PCB thermal management. This paper will invest
.. read more
Introducing Novel Flame Retardant Materials to Produce Exceptionally Low Viscosity,High Temperature Resistant Epoxy Encapsulation Compounds
The most common epoxy encapsulation compounds available on the market utilise specialised fillers,such as Alumina trihydrate (ATH),to provide a high level of flame retardancy. Such fillers deco
.. read more
A Novel Thermal Material for Multi-Layer Metal Core Printed Circuit Boards
Today,the metal core printed circuit board (MCPCB) business is booming thanks to the rising popularity of LED TV. The majority of MCPCB is single sided. However,the demand for multi-layer board
.. read more
Improvements in Microwave Laminates for Power Amplifier Reliability and Efficiency
Demands for higher data rates and capacity have continued to drive RF and Microwave electronics continue toward higher
frequency and higher power requirements. These power and frequency demands
.. read more
Optimizing the Automated Assembly Process for Filled-Polymer Based Thermal Bondlines
Great efforts are expended by researchers to develop new and better thermal interface materials. In contrast,optimization of the performance of a given material is usually left to more empirica
.. read more
Thermally Conductive Free-Standing Dielectric Materials for Printed Circuit Boards without Halogens or Phosphorous
At the same time the electronics industry is moving towards higher power and faster clock speed,components are becoming
smaller in size and packed more densely on circuit boards. Together these
.. read more
Flexible Rules Based Thermal Profiling for Surface Mount Rework
Surface Mount Rework systems have evolved into sophisticated thermal processing tools with the ability to
accurately mimic original reflow oven profiles at a localized rework site. Features suc
.. read more
Liquid Metal Enabled Soft and Stretchable Electronics
This paper summarizes recent progress on utilizing liquid metals (LMs) consisting of gallium and gallium alloys for the electronics industry. While gallium is a component of existing electro
.. read more
Thermally Conductive Polymeric Material (TCPM)
The electronics industry is seeing more data being computed through printed circuit boards (PCBs). For example, to support 5G communications, most electronics will need to increase their pro
.. read more
Electro-Thermal-Mechanical Modeling of one-Dimensional Conductors, Whiskers, and Wires Including Convection, and Considering Tin, Bismuth, Zinc And Indium
This work provides analytical solutions to the temperature rise of one-dimensional conductors such as whiskers and wires. Whisker growth from metal surfaces of electrical connectors and othe
.. read more
Thermal Materials for Packaging Power Electronics
Power electronics based on silicon devices must operate below 125 C and IGBTs under 150 C - WBG devices could extend this to 200 C. Thermal management of power electronics, whether power sup
.. read more
Solid Liquid Hybrid TIMs
For many years, metals have been used as thermal interface materials (TIMs) in the electronics industry. With high reliability and high thermal conductivity, metals have been a great solutio
.. read more
Thermal Improvement in 3D Embedded Modules Using Copper Bar Vias
The combination of increased I/O density, reduced footprint, and multi-die capability within a single platform makes embedded die an attractive solution. The benefits of embedding active die
.. read more
Novel TIM Solution with Chain Network Solder Composite
A novel epoxy SAC solder paste TIM system has been developedwith the use of non-volatile epoxy flux. Cu filler was added to the solder paste, with Cu volume % of metal ranged from 17 to 60 v
.. read more
Filling of Microvias and Through Holes by Electrolytic Copper Plating - Current Status and Future Outlook
The electronics industry is further progressing in terms of smaller,faster,smarter and more efficient electronic devices. This continuous evolving environment caused the development on various
.. read more
Laser-Based Methodology for the Application of Glass as a Dielectric and Cu Pattern Carrier for Printed Circuit Boards
Glass offers a number of advantages as a dielectric material,such as a low coefficient of thermal expansion (CTE),high dimensional stability,high thermal conductivity and suitable dielectric co
.. read more
Controlling Voiding Mechanisms in the Reflow Soldering Process
While a significant level of voiding can be tolerated in solder joints where electrical conductivity is the main requirement,voiding at any level severely compromises thermal conductivity. For
.. read more
Novel Thermally Conductive Low Pressure Overmold Materials as a Solution for Thermal Management
The dissipation of heat from a power die,such as those used to drive the increasingly popular LED arrays,has traditionally been achieved by use of a thermal interface material (TIM) and a metal
.. read more
Low Temperature Alloy Development for Electronics Assembly
New Low Temp. Alloys were developed,through elemental additions,to improve mechanical strength,fatigue life and drop shock resistance.
•Effect of these elemental additions on the new alloys was
.. read more
Thermal Characteristics of PCB Laminates used in High Frequency Applications
As technology advances,understanding thermal management issues of high frequency PCB’s increases. There are many different aspects to consider for PCB thermal management. This paper will invest
.. read more
Introducing Novel Flame Retardant Materials to Produce Exceptionally Low Viscosity,High Temperature Resistant Epoxy Encapsulation Compounds
The most common epoxy encapsulation compounds available on the market utilise specialised fillers,such as Alumina trihydrate (ATH),to provide a high level of flame retardancy. Such fillers deco
.. read more
A Novel Thermal Material for Multi-Layer Metal Core Printed Circuit Boards
Today,the metal core printed circuit board (MCPCB) business is booming thanks to the rising popularity of LED TV. The majority of MCPCB is single sided. However,the demand for multi-layer board
.. read more
Improvements in Microwave Laminates for Power Amplifier Reliability and Efficiency
Demands for higher data rates and capacity have continued to drive RF and Microwave electronics continue toward higher
frequency and higher power requirements. These power and frequency demands
.. read more
Optimizing the Automated Assembly Process for Filled-Polymer Based Thermal Bondlines
Great efforts are expended by researchers to develop new and better thermal interface materials. In contrast,optimization of the performance of a given material is usually left to more empirica
.. read more
Thermally Conductive Free-Standing Dielectric Materials for Printed Circuit Boards without Halogens or Phosphorous
At the same time the electronics industry is moving towards higher power and faster clock speed,components are becoming
smaller in size and packed more densely on circuit boards. Together these
.. read more
Flexible Rules Based Thermal Profiling for Surface Mount Rework
Surface Mount Rework systems have evolved into sophisticated thermal processing tools with the ability to
accurately mimic original reflow oven profiles at a localized rework site. Features suc
.. read more