Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Automated Design Analysis: Reliability Modeling of Circuit Card Assemblies
It is widely known and understood that the overall cost and quality of a product is most influenced by decisions made early in the design stage. Finding and correcting design flaws later in the
.. read more
Investigation of Process Feasibility / Compatibility and Solder Joint Reliability of Tin-Lead Dippable Solder Paste Ball Grid Array (BGA) Component...
This paper is an examination of the process feasibility,solder joint reliability,and materials/process compatibility of a dippable solder paste material for an area array component rework/repai
.. read more
Development of a Lead-Free Alloy for High-Reliability,High-Temperature Applications
Though the electronics industry is nearing the 3-year anniversary marking the ban of lead from electronics products,several
challenges still remain with existing lead-free materials for certain
.. read more
Embedded Passives ….Predictability,As-Received and In-Service
Embedded passives technology offers high-density high-performance solutions,but needs characterization before becoming a resource in harsh-environment applications. This paper discusses two cri
.. read more
Effect of Area Array Package Types on Assembly Reliability and Comments on IPC-9701A
Status of thermal cycle test results for a nonfunctional daisy-chained peripheral ceramic column grid array (CCGA) and its
plastic ball grid array (PBGA) version,both having 560 I/Os,were prese
.. read more
JCAA/JG-PP Lead Free Solder Project: Combined Solder Project: Combined Environments Test
A combined environment testing was conducted for the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention
Lead free Solder project. The purpose of the project was to validate and
.. read more
Lead Free 0201 Assembly and Thermal Cycle/Aging Reliability
The many challenges with 0201 passive component assembly can be attributed to the solder paste volume,pad design,
aperture design,board finish,type of solder paste,pick-and-place,and reflow pro
.. read more
Reliability of CCGA and PBGA Assemblies
Area Array Packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now
starting to be implemented for use in military and aerospace application
.. read more
Comparison of X-ray Inspection Systems for BGA/CCGA Quality Assurance and Crack Detection
For high reliability applications,the use of x-ray technique has become an additional inspection requirement for
quality control and detection of unique defects due to manufacturing of advanced
.. read more
Automated Design Analysis: Reliability Modeling of Circuit Card Assemblies
It is widely known and understood that the overall cost and quality of a product is most influenced by decisions made early in the design stage. Finding and correcting design flaws later in the
.. read more
Investigation of Process Feasibility / Compatibility and Solder Joint Reliability of Tin-Lead Dippable Solder Paste Ball Grid Array (BGA) Component...
This paper is an examination of the process feasibility,solder joint reliability,and materials/process compatibility of a dippable solder paste material for an area array component rework/repai
.. read more
Development of a Lead-Free Alloy for High-Reliability,High-Temperature Applications
Though the electronics industry is nearing the 3-year anniversary marking the ban of lead from electronics products,several
challenges still remain with existing lead-free materials for certain
.. read more
Embedded Passives ….Predictability,As-Received and In-Service
Embedded passives technology offers high-density high-performance solutions,but needs characterization before becoming a resource in harsh-environment applications. This paper discusses two cri
.. read more
Effect of Area Array Package Types on Assembly Reliability and Comments on IPC-9701A
Status of thermal cycle test results for a nonfunctional daisy-chained peripheral ceramic column grid array (CCGA) and its
plastic ball grid array (PBGA) version,both having 560 I/Os,were prese
.. read more
JCAA/JG-PP Lead Free Solder Project: Combined Solder Project: Combined Environments Test
A combined environment testing was conducted for the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention
Lead free Solder project. The purpose of the project was to validate and
.. read more
Lead Free 0201 Assembly and Thermal Cycle/Aging Reliability
The many challenges with 0201 passive component assembly can be attributed to the solder paste volume,pad design,
aperture design,board finish,type of solder paste,pick-and-place,and reflow pro
.. read more
Reliability of CCGA and PBGA Assemblies
Area Array Packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now
starting to be implemented for use in military and aerospace application
.. read more
Comparison of X-ray Inspection Systems for BGA/CCGA Quality Assurance and Crack Detection
For high reliability applications,the use of x-ray technique has become an additional inspection requirement for
quality control and detection of unique defects due to manufacturing of advanced
.. read more