Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Evaluations onThe Mixing andReliability Testingof Tin-Bismuth Pastes withSnAgCu BGA Components andReliability Failure Analysis Comparing CT (Computed Tomography) Inspection andCross-Sectioning
Recently there has been an increase in the evaluation of low temperature lead-free soldering materials, such as tin-bismuth, in a process known as “hybrid assembly” in which higher temperatu
.. read more
Assembly Reliability of TSOP/DFN PoP Stack Package
Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. This paper presents a reliability evaluation of a particular package-
.. read more
Effect of Voiding on Solder Joint Shock and Thermal Cycle Reliability
Solder joint void has been considered a typical phenomenon in electronics assembly. Voids are caused by entrapped gases
produced during flux volatilization during SMT,air entrapment in plated t
.. read more
Evaluations onThe Mixing andReliability Testingof Tin-Bismuth Pastes withSnAgCu BGA Components andReliability Failure Analysis Comparing CT (Computed Tomography) Inspection andCross-Sectioning
Recently there has been an increase in the evaluation of low temperature lead-free soldering materials, such as tin-bismuth, in a process known as “hybrid assembly” in which higher temperatu
.. read more
Assembly Reliability of TSOP/DFN PoP Stack Package
Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. This paper presents a reliability evaluation of a particular package-
.. read more
Effect of Voiding on Solder Joint Shock and Thermal Cycle Reliability
Solder joint void has been considered a typical phenomenon in electronics assembly. Voids are caused by entrapped gases
produced during flux volatilization during SMT,air entrapment in plated t
.. read more