Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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“Reliability of Stacked Microvia”
Reliability of Microvia has been a concern since microvias were introduced to our industry. This study was designed to understand the reliability of Type 1,Type 2,and Type 3 Microvias. Reliabil
.. read more
Pb-free Solder Joint Reliability in a Mildly Accelerated Test Condition
Two different temperature cycling profiles were used to compare the thermal fatigue reliability of Pb free and SnPb solder joints in 16 different,high strain surface mount (SMT) packages. In so
.. read more
Management and Mitigation of Tin Whiskers for Lead-Free Electronics
The lead-free directive from the EU has created a number of challenges for high reliability electronic applications. Key among those challenges is the need to address the issue of tin whiskers.
.. read more
The Effect of Filling VIA-In-Pad-On Voiding Rates in PWB Assembly for BGA Components
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize
voiding,particularly with the advent of lead-free processing and in fine f
.. read more
Stress Effects on Thin Film Nichrome Embedded Resistor Tolerance
Electronic devices with high performance are becoming smaller and lighter. The passive components required to
enable high performance consume premium space on the surface of the printed circuit
.. read more
“Reliability of Stacked Microvia”
Reliability of Microvia has been a concern since microvias were introduced to our industry. This study was designed to understand the reliability of Type 1,Type 2,and Type 3 Microvias. Reliabil
.. read more
Pb-free Solder Joint Reliability in a Mildly Accelerated Test Condition
Two different temperature cycling profiles were used to compare the thermal fatigue reliability of Pb free and SnPb solder joints in 16 different,high strain surface mount (SMT) packages. In so
.. read more
Management and Mitigation of Tin Whiskers for Lead-Free Electronics
The lead-free directive from the EU has created a number of challenges for high reliability electronic applications. Key among those challenges is the need to address the issue of tin whiskers.
.. read more
The Effect of Filling VIA-In-Pad-On Voiding Rates in PWB Assembly for BGA Components
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize
voiding,particularly with the advent of lead-free processing and in fine f
.. read more
Stress Effects on Thin Film Nichrome Embedded Resistor Tolerance
Electronic devices with high performance are becoming smaller and lighter. The passive components required to
enable high performance consume premium space on the surface of the printed circuit
.. read more