Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Lead-Free, Low-Temperature Solder Paste for Drop Shock Critical Applications
The 2017 International Electronics Manufacturing Initiatives (iNEMI) Board and Assembly Roadmap had forecast a 20% adoption rate of low-temperature solders (LTS) for board assembly by 2027.
.. read more
Improving Thermal Cycle and Mechanical Drop Impact Resistance of a Lead-Free Tin-Silver-Bismuth-Indium Solder Alloy with Minor Doping of Copper Additive
For a demanding automotive electronics assembly,a highly thermal fatigue resistant solder alloy is required,which makes the lead-free Sn-Ag-Cu type solder alloy unusable. Sn-Ag-Bi-In solder all
.. read more
Performance of Photoimageable Solder Masks – A Study on Thermal Stress
The continuous temperature resistance of electrically insulating materials can be judged by examining the effect of thermal stress loads on the electrical properties,such as moisture and insula
.. read more
Lead-Free and Mixed Assembly Solder Joint Reliability Trends
This paper presents a quantitative analysis of solder joint reliability data for lead-free Sn-Ag-Cu (SAC) and mixed assembly
(SnPb + SAC) circuit boards based on an extensive,but non-exhaustive
.. read more
Lead-Free, Low-Temperature Solder Paste for Drop Shock Critical Applications
The 2017 International Electronics Manufacturing Initiatives (iNEMI) Board and Assembly Roadmap had forecast a 20% adoption rate of low-temperature solders (LTS) for board assembly by 2027.
.. read more
Improving Thermal Cycle and Mechanical Drop Impact Resistance of a Lead-Free Tin-Silver-Bismuth-Indium Solder Alloy with Minor Doping of Copper Additive
For a demanding automotive electronics assembly,a highly thermal fatigue resistant solder alloy is required,which makes the lead-free Sn-Ag-Cu type solder alloy unusable. Sn-Ag-Bi-In solder all
.. read more
Performance of Photoimageable Solder Masks – A Study on Thermal Stress
The continuous temperature resistance of electrically insulating materials can be judged by examining the effect of thermal stress loads on the electrical properties,such as moisture and insula
.. read more
Lead-Free and Mixed Assembly Solder Joint Reliability Trends
This paper presents a quantitative analysis of solder joint reliability data for lead-free Sn-Ag-Cu (SAC) and mixed assembly
(SnPb + SAC) circuit boards based on an extensive,but non-exhaustive
.. read more