Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High Reliability Performance up to 175 C

A novel lead-free solder alloy 90.6Sn3.2Ag0.7Cu5.5Sb (SACSb),was developed targeted for high reliability with a wide service temperature capability. The alloy exhibited a melting temperature ra .. read more

High Temperature Reliability of Components for Power Computing with SAC305 and Alternative High Reliability Solders with Isothermal Aging at 25...

This experiment considers the reliability of a variety of different electronic components under isothermal aging and subsequent thermal cycling (TC) testing. The components are evaluated on 0.2 .. read more

Embedded Components: A Comparative Analysis of Reliability

In light of new process and product technologies in the field of embedded components,questions arise with respect to advantages and potential disadvantages to standard SMT component placement w .. read more

Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High Reliability Performance up to 175 C

A novel lead-free solder alloy 90.6Sn3.2Ag0.7Cu5.5Sb (SACSb),was developed targeted for high reliability with a wide service temperature capability. The alloy exhibited a melting temperature ra .. read more

High Temperature Reliability of Components for Power Computing with SAC305 and Alternative High Reliability Solders with Isothermal Aging at 25...

This experiment considers the reliability of a variety of different electronic components under isothermal aging and subsequent thermal cycling (TC) testing. The components are evaluated on 0.2 .. read more

Embedded Components: A Comparative Analysis of Reliability

In light of new process and product technologies in the field of embedded components,questions arise with respect to advantages and potential disadvantages to standard SMT component placement w .. read more