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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A Proposed Mechanism and Remedy for Ball-in-Socket and Foot-in-Mud Soldering Defects on Ball Grid Array and Quad Flat Pack Components
A common source of defects on area array components is the “ball-in-socket” (or “pillowhead”) defect. This defect is
defined as one or more connections that show physical contact but no wetting
.. read more
Thermal Mechanical Analysis T-260 Printed Wiring Board Testing
Evaluation of printed wiring boards (PWBs) for thermal reliability during assembly and rework operations by Thermal
Mechanical Analyzer (TMA) “T-260” testing has been an accepted practice for m
.. read more
A Proposed Mechanism and Remedy for Ball-in-Socket and Foot-in-Mud Soldering Defects on Ball Grid Array and Quad Flat Pack Components
A common source of defects on area array components is the “ball-in-socket” (or “pillowhead”) defect. This defect is
defined as one or more connections that show physical contact but no wetting
.. read more
Thermal Mechanical Analysis T-260 Printed Wiring Board Testing
Evaluation of printed wiring boards (PWBs) for thermal reliability during assembly and rework operations by Thermal
Mechanical Analyzer (TMA) “T-260” testing has been an accepted practice for m
.. read more