Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Electrical and Thermo-Mechanical Design Constraints Affecting System and Component Performance
This slide show presents solutions to the relevant Power Module question: "What has to be considered within a PCB, if currents with about 50 A and voltages above 500 V should be designed?"&n
.. read more
IPC/IMEC/ESA Microvia TV IST Test Results
This slide show discusses Automation of IST testing. It utilizes Dielectric estimation laminate assessment method (DELAM). The slides utilizes thermo-graphics to locate the failu
.. read more
Effect of QFN I/O Pad Solder Paste Overprint on Thermal Pad Void Reduction
QFN-Quad Flat No-lead SMT-surface mount technology components continue to be increasingly used and also becoming smaller for applications further requiring a high level of thermal performanc
.. read more
High Power LED and Thermal Management
A high-power-SMD-LED (HL-LED) outline 3,3 x 2,9 mm² was developed,with chip-size up to 1 mm² and power dissipation
up to 1.500 mW (400 mA for UV-InGaN) in a corresponding thermal ambient. The t
.. read more
Electrical and Thermo-Mechanical Design Constraints Affecting System and Component Performance
This slide show presents solutions to the relevant Power Module question: "What has to be considered within a PCB, if currents with about 50 A and voltages above 500 V should be designed?"&n
.. read more
IPC/IMEC/ESA Microvia TV IST Test Results
This slide show discusses Automation of IST testing. It utilizes Dielectric estimation laminate assessment method (DELAM). The slides utilizes thermo-graphics to locate the failu
.. read more
Effect of QFN I/O Pad Solder Paste Overprint on Thermal Pad Void Reduction
QFN-Quad Flat No-lead SMT-surface mount technology components continue to be increasingly used and also becoming smaller for applications further requiring a high level of thermal performanc
.. read more
High Power LED and Thermal Management
A high-power-SMD-LED (HL-LED) outline 3,3 x 2,9 mm² was developed,with chip-size up to 1 mm² and power dissipation
up to 1.500 mW (400 mA for UV-InGaN) in a corresponding thermal ambient. The t
.. read more