Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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High-Performance Phase Change Metal TIMs
For the last several years, we have seen an increase in liquid metal usage as a thermal interface material (TIM) in the semiconductor industry. The primary reason for this increase is that h
.. read more
Critical Factors for Minimizing Interfacial Resistance in Thermal Interface Material Applications
Thermal interface material (TIM) is an integral part of thermal management strategies for electronic applications. TIM is commonly used in between a heat generating component (e.g. microelec
.. read more
Silicone Thermally Conductive Grease: Improving Thermal Management of Electronic Assemblies
The trend of incorporating more and more electronic devices into our daily life is bringing challenges for the industry. The need for smaller and more powerful devices is also facing one pro
.. read more
Thermal Materials for Packaging Power Electronics
Power electronics based on silicon devices must operate below 125 C and IGBTs under 150 C - WBG devices could extend this to 200 C. Thermal management of power electronics, whether power sup
.. read more
Solid Liquid Hybrid TIMs
For many years, metals have been used as thermal interface materials (TIMs) in the electronics industry. With high reliability and high thermal conductivity, metals have been a great solutio
.. read more
Novel TIM Solution with Chain Network Solder Composite
A novel epoxy SAC solder paste TIM system has been developedwith the use of non-volatile epoxy flux. Cu filler was added to the solder paste, with Cu volume % of metal ranged from 17 to 60 v
.. read more
Liquid Dispensed Thermal Materials for High Volume Manufacturing
Industry 4.0, autonomous vehicles and 5G connectivity are driving a new Internet of Things (IoT) revolution. Assembly materials like thermal interface materials (TIMs) need to be selected ke
.. read more
A Hybrid Sintering Technology for High-power Density Devices Used in Aerospace Applications
Within-application reliability and fail-safe processes paramount, aerospace applications present unique challenges for materials suppliers. As aerospace electronic devices increase in power
.. read more
Basics of (PCB) Thermal Management for LED Applications
The reader may wonder why „PCB? in the title is between quotes. The original objective of the paper was to lay a firm base for people who are involved in printed circuit board (PCB) design for
.. read more
Calculated Shear Stress Produced by Silicone and Epoxy Thermal Interface Materials (TIMs) During Thermal Cycling
Choosing a Thermal Interface Material adhesive can have an impact on the reliability of the microelectronic package in harsh thermal environments where thermal cycling temperature ranges are mo
.. read more
High-Performance Phase Change Metal TIMs
For the last several years, we have seen an increase in liquid metal usage as a thermal interface material (TIM) in the semiconductor industry. The primary reason for this increase is that h
.. read more
Critical Factors for Minimizing Interfacial Resistance in Thermal Interface Material Applications
Thermal interface material (TIM) is an integral part of thermal management strategies for electronic applications. TIM is commonly used in between a heat generating component (e.g. microelec
.. read more
Silicone Thermally Conductive Grease: Improving Thermal Management of Electronic Assemblies
The trend of incorporating more and more electronic devices into our daily life is bringing challenges for the industry. The need for smaller and more powerful devices is also facing one pro
.. read more
Thermal Materials for Packaging Power Electronics
Power electronics based on silicon devices must operate below 125 C and IGBTs under 150 C - WBG devices could extend this to 200 C. Thermal management of power electronics, whether power sup
.. read more
Solid Liquid Hybrid TIMs
For many years, metals have been used as thermal interface materials (TIMs) in the electronics industry. With high reliability and high thermal conductivity, metals have been a great solutio
.. read more
Novel TIM Solution with Chain Network Solder Composite
A novel epoxy SAC solder paste TIM system has been developedwith the use of non-volatile epoxy flux. Cu filler was added to the solder paste, with Cu volume % of metal ranged from 17 to 60 v
.. read more
Liquid Dispensed Thermal Materials for High Volume Manufacturing
Industry 4.0, autonomous vehicles and 5G connectivity are driving a new Internet of Things (IoT) revolution. Assembly materials like thermal interface materials (TIMs) need to be selected ke
.. read more
A Hybrid Sintering Technology for High-power Density Devices Used in Aerospace Applications
Within-application reliability and fail-safe processes paramount, aerospace applications present unique challenges for materials suppliers. As aerospace electronic devices increase in power
.. read more
Basics of (PCB) Thermal Management for LED Applications
The reader may wonder why „PCB? in the title is between quotes. The original objective of the paper was to lay a firm base for people who are involved in printed circuit board (PCB) design for
.. read more
Calculated Shear Stress Produced by Silicone and Epoxy Thermal Interface Materials (TIMs) During Thermal Cycling
Choosing a Thermal Interface Material adhesive can have an impact on the reliability of the microelectronic package in harsh thermal environments where thermal cycling temperature ranges are mo
.. read more