Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Critical Factors for Minimizing Interfacial Resistance in Thermal Interface Material Applications
Thermal interface material (TIM) is an integral part of thermal management strategies for electronic applications. TIM is commonly used in between a heat generating component (e.g. microelec
.. read more
Electrical and Thermo-Mechanical Design Constraints Affecting System and Component Performance
This slide show presents solutions to the relevant Power Module question: "What has to be considered within a PCB, if currents with about 50 A and voltages above 500 V should be designed?"&n
.. read more
Multiphysics Design for Thermal Management to Increase Radar Capabilities
Increased demand for radar capabilities has required increasingly more efficient thermal management techniques. Simple cold plates using tubes or channels are frequently used to cool high po
.. read more
Additive Manufacturing of a Heat Exchanger for a Radar System
The defense industry has realized the importance of Additive Manufacturing (AM) and how this technology can be utilized where parts can be fabricated inexpensively with reduction in lead tim
.. read more
Additive Manufacturing and Multiphysics Analysis for Single-Phase and Two-Phase Cooling
Thermal management must advance with the military’s requirements for increased performance, lower costs, and rapid technology changes. Combining multiphysics analysis and additive manufactur
.. read more
Thermally Conductive Polymeric Material (TCPM)
The electronics industry is seeing more data being computed through printed circuit boards (PCBs). For example, to support 5G communications, most electronics will need to increase their pro
.. read more
Thermal Materials for Packaging Power Electronics
Power electronics based on silicon devices must operate below 125 C and IGBTs under 150 C - WBG devices could extend this to 200 C. Thermal management of power electronics, whether power sup
.. read more
Filling of Microvias and Through Holes by Electrolytic Copper Plating - Current Status and Future Outlook
The electronics industry is further progressing in terms of smaller,faster,smarter and more efficient electronic devices. This continuous evolving environment caused the development on various
.. read more
Thermal Capabilities of Solder Masks and Other Coating Materials - How High Can We Go?
This paper focuses on three different coating material groups which were formulated to operate under high thermal stress and are applied at printed circuit board manufacturing level. While used
.. read more
Novel Thermally Conductive Low Pressure Overmold Materials as a Solution for Thermal Management
The dissipation of heat from a power die,such as those used to drive the increasingly popular LED arrays,has traditionally been achieved by use of a thermal interface material (TIM) and a metal
.. read more
Thermally,Electrically Conductive Adhesive Manages to Control Heat in PCBs
Thermal management is a critical element in the design and manufacturing of printed circuit boards (PCBs) for a wide range of applications. Quite simply,heat can be destructive. The more effect
.. read more
Advanced Thermal Management Solutions on PCBs for High Power Applications
With increasing power loss of electrical components,thermal performance of an assembled device becomes one of the most important quality factors in electronic packaging. Due to the rapid advanc
.. read more
Thermal Characteristics of PCB Laminates used in High Frequency Applications
As technology advances,understanding thermal management issues of high frequency PCB’s increases. There are many different aspects to consider for PCB thermal management. This paper will invest
.. read more
A Novel Thermal Material for Multi-Layer Metal Core Printed Circuit Boards
Today,the metal core printed circuit board (MCPCB) business is booming thanks to the rising popularity of LED TV. The majority of MCPCB is single sided. However,the demand for multi-layer board
.. read more
Basics of (PCB) Thermal Management for LED Applications
The reader may wonder why „PCB? in the title is between quotes. The original objective of the paper was to lay a firm base for people who are involved in printed circuit board (PCB) design for
.. read more
The Value of IPC-2152
Current carrying capacity in printed board design is technology dependent and an element of printed circuit board thermal
management. Conductor temperature rise as a function of current is depe
.. read more
New Reinforcement Material can Solve Heat and Co-Efficient of Thermal Expansion Challenges of the Printed Circuit Board and IC Substrate
Printed Circuit Boards (PCB) and IC Substrates are the essential building blocks of electronics. As the technology moves rapidly into the future,the electronics industry faces issues with hot s
.. read more
Single Ball Reballing and Repair of BGA Components
The trend of increasing complication in the rework arena continues. Sources of today’s rework challenges include the
development of smaller and smaller components and the continued difficulty o
.. read more
High Power LED and Thermal Management
A high-power-SMD-LED (HL-LED) outline 3,3 x 2,9 mm² was developed,with chip-size up to 1 mm² and power dissipation
up to 1.500 mW (400 mA for UV-InGaN) in a corresponding thermal ambient. The t
.. read more
Critical Factors for Minimizing Interfacial Resistance in Thermal Interface Material Applications
Thermal interface material (TIM) is an integral part of thermal management strategies for electronic applications. TIM is commonly used in between a heat generating component (e.g. microelec
.. read more
Electrical and Thermo-Mechanical Design Constraints Affecting System and Component Performance
This slide show presents solutions to the relevant Power Module question: "What has to be considered within a PCB, if currents with about 50 A and voltages above 500 V should be designed?"&n
.. read more
Multiphysics Design for Thermal Management to Increase Radar Capabilities
Increased demand for radar capabilities has required increasingly more efficient thermal management techniques. Simple cold plates using tubes or channels are frequently used to cool high po
.. read more
Additive Manufacturing of a Heat Exchanger for a Radar System
The defense industry has realized the importance of Additive Manufacturing (AM) and how this technology can be utilized where parts can be fabricated inexpensively with reduction in lead tim
.. read more
Additive Manufacturing and Multiphysics Analysis for Single-Phase and Two-Phase Cooling
Thermal management must advance with the military’s requirements for increased performance, lower costs, and rapid technology changes. Combining multiphysics analysis and additive manufactur
.. read more
Thermally Conductive Polymeric Material (TCPM)
The electronics industry is seeing more data being computed through printed circuit boards (PCBs). For example, to support 5G communications, most electronics will need to increase their pro
.. read more
Thermal Materials for Packaging Power Electronics
Power electronics based on silicon devices must operate below 125 C and IGBTs under 150 C - WBG devices could extend this to 200 C. Thermal management of power electronics, whether power sup
.. read more
Filling of Microvias and Through Holes by Electrolytic Copper Plating - Current Status and Future Outlook
The electronics industry is further progressing in terms of smaller,faster,smarter and more efficient electronic devices. This continuous evolving environment caused the development on various
.. read more
Thermal Capabilities of Solder Masks and Other Coating Materials - How High Can We Go?
This paper focuses on three different coating material groups which were formulated to operate under high thermal stress and are applied at printed circuit board manufacturing level. While used
.. read more
Novel Thermally Conductive Low Pressure Overmold Materials as a Solution for Thermal Management
The dissipation of heat from a power die,such as those used to drive the increasingly popular LED arrays,has traditionally been achieved by use of a thermal interface material (TIM) and a metal
.. read more
Thermally,Electrically Conductive Adhesive Manages to Control Heat in PCBs
Thermal management is a critical element in the design and manufacturing of printed circuit boards (PCBs) for a wide range of applications. Quite simply,heat can be destructive. The more effect
.. read more
Advanced Thermal Management Solutions on PCBs for High Power Applications
With increasing power loss of electrical components,thermal performance of an assembled device becomes one of the most important quality factors in electronic packaging. Due to the rapid advanc
.. read more
Thermal Characteristics of PCB Laminates used in High Frequency Applications
As technology advances,understanding thermal management issues of high frequency PCB’s increases. There are many different aspects to consider for PCB thermal management. This paper will invest
.. read more
A Novel Thermal Material for Multi-Layer Metal Core Printed Circuit Boards
Today,the metal core printed circuit board (MCPCB) business is booming thanks to the rising popularity of LED TV. The majority of MCPCB is single sided. However,the demand for multi-layer board
.. read more
Basics of (PCB) Thermal Management for LED Applications
The reader may wonder why „PCB? in the title is between quotes. The original objective of the paper was to lay a firm base for people who are involved in printed circuit board (PCB) design for
.. read more
The Value of IPC-2152
Current carrying capacity in printed board design is technology dependent and an element of printed circuit board thermal
management. Conductor temperature rise as a function of current is depe
.. read more
New Reinforcement Material can Solve Heat and Co-Efficient of Thermal Expansion Challenges of the Printed Circuit Board and IC Substrate
Printed Circuit Boards (PCB) and IC Substrates are the essential building blocks of electronics. As the technology moves rapidly into the future,the electronics industry faces issues with hot s
.. read more
Single Ball Reballing and Repair of BGA Components
The trend of increasing complication in the rework arena continues. Sources of today’s rework challenges include the
development of smaller and smaller components and the continued difficulty o
.. read more
High Power LED and Thermal Management
A high-power-SMD-LED (HL-LED) outline 3,3 x 2,9 mm² was developed,with chip-size up to 1 mm² and power dissipation
up to 1.500 mW (400 mA for UV-InGaN) in a corresponding thermal ambient. The t
.. read more