Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Realization of a New Concept for Power Chip Embedding
Embedded components technology has launched its implementation in volume products demanding high levels of miniaturization. Small modules with embedded dies and passive components on the top
.. read more
Silicone Thermally Conductive Grease: Improving Thermal Management of Electronic Assemblies
The trend of incorporating more and more electronic devices into our daily life is bringing challenges for the industry. The need for smaller and more powerful devices is also facing one pro
.. read more
Study Of Performance of Liquid Metal Containing Different Contents of Ag Particular Additives for Thermal Interface Materials
In the present research, we have studied the influence of Ag additives on wettability, adhesion, oxidation, viscosity and modulus of liquid metal on two alloys – Liquid Metal 1 (“LM1”) (62.5
.. read more
Thermally Conductive and Electrically Insulative Multi-functional Film Adhesives for Assembling High-power Density Devices
In many aerospace and defense systems, there are increasing demands for multi-functional adhesive solutions that not only fulfill the traditional role of component and assembly bonding, but
.. read more
Liquid Dispensed Thermal Materials for High Volume Manufacturing
Industry 4.0, autonomous vehicles and 5G connectivity are driving a new Internet of Things (IoT) revolution. Assembly materials like thermal interface materials (TIMs) need to be selected ke
.. read more
A Hybrid Sintering Technology for High-power Density Devices Used in Aerospace Applications
Within-application reliability and fail-safe processes paramount, aerospace applications present unique challenges for materials suppliers. As aerospace electronic devices increase in power
.. read more
Evaluation and Characterization of Molded flip-chip BGA Package for 28nm FPGA Applications
As the FPGA device technology migrates to 28nm technology node and high performance applications,selecting the right package to meet the customer usability requirements and to achieve product r
.. read more
The Effects of Lead-Free Reflow on Conductive Anodic Filament (CAF) Performance of Materials
This paper details the results achieved by the High Density Packaging Users Group (HDPUG) Consortium investigating the hole-wall to hole-wall CAF performance of 20 different Pb-free printed wir
.. read more
Die Attach Solder Materials and Application Technology
Advancing technology frequently requires an accompanying advancement in materials technology. Recently,these advances are also driven by changes in environmental legislation as well. Specifical
.. read more
Optimizing the Automated Assembly Process for Filled-Polymer Based Thermal Bondlines
Great efforts are expended by researchers to develop new and better thermal interface materials. In contrast,optimization of the performance of a given material is usually left to more empirica
.. read more
New Laminates for High Reliability Printed Circuit Boards
The challenges for today’s PCBs are many,including higher assembly temperatures and higher device heat transfer
temperatures; faster clock cycles and higher bandwidths; higher component density
.. read more
Utilizing 3D Package Technology for Complex SiP Applications - Innovative Solutions for System Level Integration and Miniaturization
Hand-held communication and entertainment products continue to dominate the consumer markets worldwide,and with each
generation,companies are offering more and more features and/or capability.
.. read more
Realization of a New Concept for Power Chip Embedding
Embedded components technology has launched its implementation in volume products demanding high levels of miniaturization. Small modules with embedded dies and passive components on the top
.. read more
Silicone Thermally Conductive Grease: Improving Thermal Management of Electronic Assemblies
The trend of incorporating more and more electronic devices into our daily life is bringing challenges for the industry. The need for smaller and more powerful devices is also facing one pro
.. read more
Study Of Performance of Liquid Metal Containing Different Contents of Ag Particular Additives for Thermal Interface Materials
In the present research, we have studied the influence of Ag additives on wettability, adhesion, oxidation, viscosity and modulus of liquid metal on two alloys – Liquid Metal 1 (“LM1”) (62.5
.. read more
Thermally Conductive and Electrically Insulative Multi-functional Film Adhesives for Assembling High-power Density Devices
In many aerospace and defense systems, there are increasing demands for multi-functional adhesive solutions that not only fulfill the traditional role of component and assembly bonding, but
.. read more
Liquid Dispensed Thermal Materials for High Volume Manufacturing
Industry 4.0, autonomous vehicles and 5G connectivity are driving a new Internet of Things (IoT) revolution. Assembly materials like thermal interface materials (TIMs) need to be selected ke
.. read more
A Hybrid Sintering Technology for High-power Density Devices Used in Aerospace Applications
Within-application reliability and fail-safe processes paramount, aerospace applications present unique challenges for materials suppliers. As aerospace electronic devices increase in power
.. read more
Evaluation and Characterization of Molded flip-chip BGA Package for 28nm FPGA Applications
As the FPGA device technology migrates to 28nm technology node and high performance applications,selecting the right package to meet the customer usability requirements and to achieve product r
.. read more
The Effects of Lead-Free Reflow on Conductive Anodic Filament (CAF) Performance of Materials
This paper details the results achieved by the High Density Packaging Users Group (HDPUG) Consortium investigating the hole-wall to hole-wall CAF performance of 20 different Pb-free printed wir
.. read more
Die Attach Solder Materials and Application Technology
Advancing technology frequently requires an accompanying advancement in materials technology. Recently,these advances are also driven by changes in environmental legislation as well. Specifical
.. read more
Optimizing the Automated Assembly Process for Filled-Polymer Based Thermal Bondlines
Great efforts are expended by researchers to develop new and better thermal interface materials. In contrast,optimization of the performance of a given material is usually left to more empirica
.. read more
New Laminates for High Reliability Printed Circuit Boards
The challenges for today’s PCBs are many,including higher assembly temperatures and higher device heat transfer
temperatures; faster clock cycles and higher bandwidths; higher component density
.. read more
Utilizing 3D Package Technology for Complex SiP Applications - Innovative Solutions for System Level Integration and Miniaturization
Hand-held communication and entertainment products continue to dominate the consumer markets worldwide,and with each
generation,companies are offering more and more features and/or capability.
.. read more