Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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48V 250A FET PCB Thermal Profile - A Thermal Simulation Using 2D And CFD Airflow Analysis
This case analysis evaluates the thermal profile of 10 FETs rated at 48V, 250A under 100 secs soak time with all the thermally enhanced mechanical attachments installed. The goal was for the
.. read more
Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment
An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturing environment
.. read more
Investigation of Process Feasibility / Compatibility and Solder Joint Reliability of Tin-Lead Dippable Solder Paste Ball Grid Array (BGA) Component...
This paper is an examination of the process feasibility,solder joint reliability,and materials/process compatibility of a dippable solder paste material for an area array component rework/repai
.. read more
Solder Paste Residue Corrosivity Assessment: Bono Test
Lead free soldering with no clean solder pastes represent nowadays the most common process in electronic assembly. A solder paste is usually considered as no-clean if it passes all IPC J-STD-00
.. read more
Performing Flux-Technology for Pb-Free SN100C Solders
SN100C (Sn99Cu0.7 with Ni- and Ge-micro-additions) is a lead-free solder alloy that is finding increased acceptance globally and holds promise as a mainstream solution in terms of long-term sol
.. read more
Hybrid Drying Technology for In-line Aqueous
boards in the in-line aqueous cleaning process. As lead-free circuit boards become more complex and component spacing
decreases,the effectiveness of direct blow-off drying is greatly diminished
.. read more
Reflow Process Control Monitoring,and Data Logging
With the introduction of lead free electronics assembly worldwide,greater concerns are raised over factory control of materials and processes. Due to the mix of both leaded and lead free produc
.. read more
Capabilities of Tools Used to Measure Voids to Industry Standards
It is stated that some degree of voiding is acceptable and inevitable when soldering electronic components,and
specifically BGAs. There have been many publications which discuss this phenomena,
.. read more
Automated SPC for the Reflow Process
This paper will discuss the implementation of real-time automated SPC for the Reflow Process. Topics covered will include: a new statistical method for quantifying the thermal process performan
.. read more
48V 250A FET PCB Thermal Profile - A Thermal Simulation Using 2D And CFD Airflow Analysis
This case analysis evaluates the thermal profile of 10 FETs rated at 48V, 250A under 100 secs soak time with all the thermally enhanced mechanical attachments installed. The goal was for the
.. read more
Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment
An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturing environment
.. read more
Investigation of Process Feasibility / Compatibility and Solder Joint Reliability of Tin-Lead Dippable Solder Paste Ball Grid Array (BGA) Component...
This paper is an examination of the process feasibility,solder joint reliability,and materials/process compatibility of a dippable solder paste material for an area array component rework/repai
.. read more
Solder Paste Residue Corrosivity Assessment: Bono Test
Lead free soldering with no clean solder pastes represent nowadays the most common process in electronic assembly. A solder paste is usually considered as no-clean if it passes all IPC J-STD-00
.. read more
Performing Flux-Technology for Pb-Free SN100C Solders
SN100C (Sn99Cu0.7 with Ni- and Ge-micro-additions) is a lead-free solder alloy that is finding increased acceptance globally and holds promise as a mainstream solution in terms of long-term sol
.. read more
Hybrid Drying Technology for In-line Aqueous
boards in the in-line aqueous cleaning process. As lead-free circuit boards become more complex and component spacing
decreases,the effectiveness of direct blow-off drying is greatly diminished
.. read more
Reflow Process Control Monitoring,and Data Logging
With the introduction of lead free electronics assembly worldwide,greater concerns are raised over factory control of materials and processes. Due to the mix of both leaded and lead free produc
.. read more
Capabilities of Tools Used to Measure Voids to Industry Standards
It is stated that some degree of voiding is acceptable and inevitable when soldering electronic components,and
specifically BGAs. There have been many publications which discuss this phenomena,
.. read more
Automated SPC for the Reflow Process
This paper will discuss the implementation of real-time automated SPC for the Reflow Process. Topics covered will include: a new statistical method for quantifying the thermal process performan
.. read more