Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Silicone Thermally Conductive Grease: Improving Thermal Management of Electronic Assemblies
The trend of incorporating more and more electronic devices into our daily life is bringing challenges for the industry. The need for smaller and more powerful devices is also facing one pro
.. read more
Long term Thermal Reliability of Printed Circuit Board Materials
This paper describes the purpose,methodology,and results to date of thermal endurance testing performed at the company. The intent of this thermal aging testing is to establish long term reliab
.. read more
Understanding when to use FR-4 laminates or High Frequency Laminates
Over the years a question that has been asked repeatedly of material suppliers is: “when do I need to use a high frequency laminate over the choice of a standard FR-4 substrate”? The answer has
.. read more
A Study of Alternative Lead Free Wave Alloys: From Process Yield to Reliability
Recent industry trends have focused around alternatives for the commonly used SAC305 or SAC405 alloys for wave soldering and solder fountain rework processes. Industry consortia are currently f
.. read more
Effect of Area Array Package Types on Assembly Reliability and Comments on IPC-9701A
Status of thermal cycle test results for a nonfunctional daisy-chained peripheral ceramic column grid array (CCGA) and its
plastic ball grid array (PBGA) version,both having 560 I/Os,were prese
.. read more
The Effect of Thermal Loaded Bend Test on the Solder Joint Reliability
With the function of today’s electronic devices become more and more complicate,the high I/O flip chip ball grid array
package (FCBGA) is used more popularly in recent years. The FCBGA package
.. read more
Thermal Mechanical Analysis T-260 Printed Wiring Board Testing
Evaluation of printed wiring boards (PWBs) for thermal reliability during assembly and rework operations by Thermal
Mechanical Analyzer (TMA) “T-260” testing has been an accepted practice for m
.. read more
Silicone Thermally Conductive Grease: Improving Thermal Management of Electronic Assemblies
The trend of incorporating more and more electronic devices into our daily life is bringing challenges for the industry. The need for smaller and more powerful devices is also facing one pro
.. read more
Long term Thermal Reliability of Printed Circuit Board Materials
This paper describes the purpose,methodology,and results to date of thermal endurance testing performed at the company. The intent of this thermal aging testing is to establish long term reliab
.. read more
Understanding when to use FR-4 laminates or High Frequency Laminates
Over the years a question that has been asked repeatedly of material suppliers is: “when do I need to use a high frequency laminate over the choice of a standard FR-4 substrate”? The answer has
.. read more
A Study of Alternative Lead Free Wave Alloys: From Process Yield to Reliability
Recent industry trends have focused around alternatives for the commonly used SAC305 or SAC405 alloys for wave soldering and solder fountain rework processes. Industry consortia are currently f
.. read more
Effect of Area Array Package Types on Assembly Reliability and Comments on IPC-9701A
Status of thermal cycle test results for a nonfunctional daisy-chained peripheral ceramic column grid array (CCGA) and its
plastic ball grid array (PBGA) version,both having 560 I/Os,were prese
.. read more
The Effect of Thermal Loaded Bend Test on the Solder Joint Reliability
With the function of today’s electronic devices become more and more complicate,the high I/O flip chip ball grid array
package (FCBGA) is used more popularly in recent years. The FCBGA package
.. read more
Thermal Mechanical Analysis T-260 Printed Wiring Board Testing
Evaluation of printed wiring boards (PWBs) for thermal reliability during assembly and rework operations by Thermal
Mechanical Analyzer (TMA) “T-260” testing has been an accepted practice for m
.. read more