Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
Solid Liquid Hybrid TIMs - Part II The Power of Liquid Metal Composites
In a previous paper [8], solid liquid hybrids (SLHs) were presented as a combination of metals that are solid at room temperature with ones that are liquid at room temperature. Those materia
.. read more
Thermal Materials for Packaging Power Electronics
Power electronics based on silicon devices must operate below 125 C and IGBTs under 150 C - WBG devices could extend this to 200 C. Thermal management of power electronics, whether power sup
.. read more
Solid Liquid Hybrid TIMs
For many years, metals have been used as thermal interface materials (TIMs) in the electronics industry. With high reliability and high thermal conductivity, metals have been a great solutio
.. read more
Filling of Microvias and Through Holes by Electrolytic Copper Plating - Current Status and Future Outlook
The electronics industry is further progressing in terms of smaller,faster,smarter and more efficient electronic devices. This continuous evolving environment caused the development on various
.. read more
A Novel Thermal Material for Multi-Layer Metal Core Printed Circuit Boards
Today,the metal core printed circuit board (MCPCB) business is booming thanks to the rising popularity of LED TV. The majority of MCPCB is single sided. However,the demand for multi-layer board
.. read more
Basics of (PCB) Thermal Management for LED Applications
The reader may wonder why „PCB? in the title is between quotes. The original objective of the paper was to lay a firm base for people who are involved in printed circuit board (PCB) design for
.. read more
Die Attach Solder Materials and Application Technology
Advancing technology frequently requires an accompanying advancement in materials technology. Recently,these advances are also driven by changes in environmental legislation as well. Specifical
.. read more
A Novel Halogen-Free Material for High Speed PCB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. read more
Optimizing the Automated Assembly Process for Filled-Polymer Based Thermal Bondlines
Great efforts are expended by researchers to develop new and better thermal interface materials. In contrast,optimization of the performance of a given material is usually left to more empirica
.. read more
Novel Low Dk/Df Materials for High Speed PWB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. read more
Running Lead Free Reflow Profiles Without Nitrogen
The widespread use of SAC-based (SnAgCu) lead-free solder paste drives the industry toward reflow profiles that are
considerably longer than those used for lead-bearing products. This is due to
.. read more
Characterization of the Thermal Stability of Electrical Laminates Suitable for Lead-Free Soldering
Lead-free soldering is expected to become the new standard in the future. Different legislations or draft directives target the restriction or the ban of the use of lead in the world. As an exa
.. read more
Key Application Issues for Implementing Package-Applied Underfill
Applying underfill materials to the bottom of components prior to shipping to the 2nd level end-user is very desirable
in that it would eliminate the underfill process from the end-users assemb
.. read more
Solid Liquid Hybrid TIMs - Part II The Power of Liquid Metal Composites
In a previous paper [8], solid liquid hybrids (SLHs) were presented as a combination of metals that are solid at room temperature with ones that are liquid at room temperature. Those materia
.. read more
Thermal Materials for Packaging Power Electronics
Power electronics based on silicon devices must operate below 125 C and IGBTs under 150 C - WBG devices could extend this to 200 C. Thermal management of power electronics, whether power sup
.. read more
Solid Liquid Hybrid TIMs
For many years, metals have been used as thermal interface materials (TIMs) in the electronics industry. With high reliability and high thermal conductivity, metals have been a great solutio
.. read more
Filling of Microvias and Through Holes by Electrolytic Copper Plating - Current Status and Future Outlook
The electronics industry is further progressing in terms of smaller,faster,smarter and more efficient electronic devices. This continuous evolving environment caused the development on various
.. read more
A Novel Thermal Material for Multi-Layer Metal Core Printed Circuit Boards
Today,the metal core printed circuit board (MCPCB) business is booming thanks to the rising popularity of LED TV. The majority of MCPCB is single sided. However,the demand for multi-layer board
.. read more
Basics of (PCB) Thermal Management for LED Applications
The reader may wonder why „PCB? in the title is between quotes. The original objective of the paper was to lay a firm base for people who are involved in printed circuit board (PCB) design for
.. read more
Die Attach Solder Materials and Application Technology
Advancing technology frequently requires an accompanying advancement in materials technology. Recently,these advances are also driven by changes in environmental legislation as well. Specifical
.. read more
A Novel Halogen-Free Material for High Speed PCB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. read more
Optimizing the Automated Assembly Process for Filled-Polymer Based Thermal Bondlines
Great efforts are expended by researchers to develop new and better thermal interface materials. In contrast,optimization of the performance of a given material is usually left to more empirica
.. read more
Novel Low Dk/Df Materials for High Speed PWB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. read more
Running Lead Free Reflow Profiles Without Nitrogen
The widespread use of SAC-based (SnAgCu) lead-free solder paste drives the industry toward reflow profiles that are
considerably longer than those used for lead-bearing products. This is due to
.. read more
Characterization of the Thermal Stability of Electrical Laminates Suitable for Lead-Free Soldering
Lead-free soldering is expected to become the new standard in the future. Different legislations or draft directives target the restriction or the ban of the use of lead in the world. As an exa
.. read more
Key Application Issues for Implementing Package-Applied Underfill
Applying underfill materials to the bottom of components prior to shipping to the 2nd level end-user is very desirable
in that it would eliminate the underfill process from the end-users assemb
.. read more