Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Microvia Reliability Testing Utilizing D-Coupons to Understand Best Design Practice
As Printed Circuit Board (PCB) designs increase in density, the need for High Density Interconnect (HDI) structures such as microvias is also increasing. With this uptick in microvia usage,
.. read more
IPC/IMEC/ESA Microvia TV Introduction
This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structu
.. read more
Printable Materials and Devices
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play an important role for developing advanced printable technology.
.. read more
Solder Charge Grid Array: Advancements in the Technology of Surface Mount Area Array Solder Joint Attachment
Surface mount area arrays (SMAA) have been in existence for decades and are increasingly becoming more important as printed circuit board (PCB) assemblies become further complex with package mi
.. read more
Comparison of the Electrochemical and Physical Properties of Nanocrystalline Copper Deposition in the Fabrication of Printed Wiring Boards
Typical electrodeposition of conventional metals produces deposits that are polycrystalline in nature,comprised of many crystal grains separated by grain boundaries. Adding grain refiners to a
.. read more
Qualification of Thin Form Factor PWBs for Handset Assembly
The handheld wireless product market place demands products that are small,thin,low-cost and lightweight and improved user interfaces. In addition,the convergence of handheld wireless phones wi
.. read more
Influence of Electroless Copper on IC Reliability
The process of plating through holes (PTH) is inherent to modern PCB manufacturing. In an arena of increasing circuit density and layer counts,the reliability of the PTH process is under consta
.. read more
Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
.. read more
Embedded Passives ….Predictability,As-Received and In-Service
Embedded passives technology offers high-density high-performance solutions,but needs characterization before becoming a resource in harsh-environment applications. This paper discusses two cri
.. read more
Qualification of PWBs Outsourced from Asia
The growth of portable wireless products and related consumer electronics is fueling a major outsourcing effort towards Asia. Most OEM (original equipment manufacturers) are partnering with CMs
.. read more
Embedded Passives Predictability,As-Received and In-Service
Embedded resistors and capacitors provide high-density high-performance solutions,freeing up the surface for other
components and enabling tailored interconnect topology. This technology needs
.. read more
Thermal Expansion of Silicones in Electronic Reliability
CTE mismatches during temperature cycling can cause significant movement of components and materials relative to one
another,which in turn stresses solder joints and wirebonds. Silicones are of
.. read more
Effects of Reflow Profile and Thermal Shock on Intermetallic Compound Thickness for SnPb and SnAgCu Solder Joints
During the solder reflow processes many reactions occur. There is the reduction of oxides on the metal surfaces,metal dissolution,wetting to different surfaces,and intermetallic compound format
.. read more
Lead Free Assembly Qualification of Stacked MicroVia Boards
Beginning July 2006,the electronic industry will enter the age of lead –free assembly and products in Europe. The removal
of lead from electronics brings massive changes for all companies in th
.. read more
The Property Research and Applications of Vertical Pulse Copper Plating
Horizontal and vertical pulse plating have been widely used for panel plating in PCB industry,but rarely used for pattern
plating. This article analyzes and reviews the crystal structure,throwi
.. read more
Enhancement of CSP Mechanical Strength using Underfill or Bonding Material
Underfill technology has been used to minimize the mismatch of the Coefficient of Thermal Expansion (CTE)
in flip chip technology. An extension of this application has been used to increase the
.. read more
Evaluating the Use of Next Generation Reflow Profile Control for High Volume Electronics Manufacturing
In recent years,technological advances in electronics manufacturing have allowed high volume manufacturers to
significantly improve process control and documentation. Manufacturers have acceler
.. read more
Microvia Reliability Testing Utilizing D-Coupons to Understand Best Design Practice
As Printed Circuit Board (PCB) designs increase in density, the need for High Density Interconnect (HDI) structures such as microvias is also increasing. With this uptick in microvia usage,
.. read more
IPC/IMEC/ESA Microvia TV Introduction
This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structu
.. read more
Printable Materials and Devices
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play an important role for developing advanced printable technology.
.. read more
Solder Charge Grid Array: Advancements in the Technology of Surface Mount Area Array Solder Joint Attachment
Surface mount area arrays (SMAA) have been in existence for decades and are increasingly becoming more important as printed circuit board (PCB) assemblies become further complex with package mi
.. read more
Comparison of the Electrochemical and Physical Properties of Nanocrystalline Copper Deposition in the Fabrication of Printed Wiring Boards
Typical electrodeposition of conventional metals produces deposits that are polycrystalline in nature,comprised of many crystal grains separated by grain boundaries. Adding grain refiners to a
.. read more
Qualification of Thin Form Factor PWBs for Handset Assembly
The handheld wireless product market place demands products that are small,thin,low-cost and lightweight and improved user interfaces. In addition,the convergence of handheld wireless phones wi
.. read more
Influence of Electroless Copper on IC Reliability
The process of plating through holes (PTH) is inherent to modern PCB manufacturing. In an arena of increasing circuit density and layer counts,the reliability of the PTH process is under consta
.. read more
Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
.. read more
Embedded Passives ….Predictability,As-Received and In-Service
Embedded passives technology offers high-density high-performance solutions,but needs characterization before becoming a resource in harsh-environment applications. This paper discusses two cri
.. read more
Qualification of PWBs Outsourced from Asia
The growth of portable wireless products and related consumer electronics is fueling a major outsourcing effort towards Asia. Most OEM (original equipment manufacturers) are partnering with CMs
.. read more
Embedded Passives Predictability,As-Received and In-Service
Embedded resistors and capacitors provide high-density high-performance solutions,freeing up the surface for other
components and enabling tailored interconnect topology. This technology needs
.. read more
Thermal Expansion of Silicones in Electronic Reliability
CTE mismatches during temperature cycling can cause significant movement of components and materials relative to one
another,which in turn stresses solder joints and wirebonds. Silicones are of
.. read more
Effects of Reflow Profile and Thermal Shock on Intermetallic Compound Thickness for SnPb and SnAgCu Solder Joints
During the solder reflow processes many reactions occur. There is the reduction of oxides on the metal surfaces,metal dissolution,wetting to different surfaces,and intermetallic compound format
.. read more
Lead Free Assembly Qualification of Stacked MicroVia Boards
Beginning July 2006,the electronic industry will enter the age of lead –free assembly and products in Europe. The removal
of lead from electronics brings massive changes for all companies in th
.. read more
The Property Research and Applications of Vertical Pulse Copper Plating
Horizontal and vertical pulse plating have been widely used for panel plating in PCB industry,but rarely used for pattern
plating. This article analyzes and reviews the crystal structure,throwi
.. read more
Enhancement of CSP Mechanical Strength using Underfill or Bonding Material
Underfill technology has been used to minimize the mismatch of the Coefficient of Thermal Expansion (CTE)
in flip chip technology. An extension of this application has been used to increase the
.. read more
Evaluating the Use of Next Generation Reflow Profile Control for High Volume Electronics Manufacturing
In recent years,technological advances in electronics manufacturing have allowed high volume manufacturers to
significantly improve process control and documentation. Manufacturers have acceler
.. read more