Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Hot AirBGARework Process Improvement with a Touchless Temperature-Dependent Live-Feedback Process
Commonly used integrated circuits have been increasingly moving from leaded packages that are reworkable with a soldering iron to leadless packages such as BGAs that require complex rework t
.. read more
Evaluating the Accuracy of a Nondestructive Thermo Couple Attach Method for Area Array Package Profiling
The oven recipe,which consists of the reflow oven zone temperature settings and the speed of the conveyor,will determine a specific time-temperature profile for a given PCB assembly. In order t
.. read more
Hot AirBGARework Process Improvement with a Touchless Temperature-Dependent Live-Feedback Process
Commonly used integrated circuits have been increasingly moving from leaded packages that are reworkable with a soldering iron to leadless packages such as BGAs that require complex rework t
.. read more
Evaluating the Accuracy of a Nondestructive Thermo Couple Attach Method for Area Array Package Profiling
The oven recipe,which consists of the reflow oven zone temperature settings and the speed of the conveyor,will determine a specific time-temperature profile for a given PCB assembly. In order t
.. read more