Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Solve BGA VIPPO Failures with Advanced Materials
Optimal breakout of ultra-fine-pitch ball grid array (BGA) packages requires a mix of via structures – through and blind mechanical, stacked and staggered laser – often implemented in thicke
.. read more
Simulation of the Influence of Manufacturing Quality on Thermomechanical Stress of Microvias
The advancement of area-array packages,such as flip chips and chip scale packages,has driven the adoption of high density interconnects (HDIs) that allow for an increased number of I/Os with a
.. read more
Solve BGA VIPPO Failures with Advanced Materials
Optimal breakout of ultra-fine-pitch ball grid array (BGA) packages requires a mix of via structures – through and blind mechanical, stacked and staggered laser – often implemented in thicke
.. read more
Simulation of the Influence of Manufacturing Quality on Thermomechanical Stress of Microvias
The advancement of area-array packages,such as flip chips and chip scale packages,has driven the adoption of high density interconnects (HDIs) that allow for an increased number of I/Os with a
.. read more