Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Stencil Options for Printing Solder Paste for .3 Mm CSP’s and 01005 Chip Components
Printing solder paste for very small components like .3mm pitch CSP’s and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields,SMT Connecto
.. read more
High Frequency Circuit Materials used in the PCB Industry
Specialty high frequency circuit materials have been used in the PCB industry for decades and for many different reasons. There are several attributes of these materials that are very unique wh
.. read more
Microwave Characteristics and Applications of Liquid Crystal Polymer Flex
We present the electrical characterization of our Liquid Crystal Polymer (LCP) at microwave and millimeter frequencies and the applications of LCP to circuit components. We use several methodol
.. read more
Lessons Learned About Laminates during Migration to Lead-Free Soldering
This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr
.. read more
Effect of Conformal Coating on Tin Whisker Growth
This paper will present the testing performed to date by Lockheed Martin Missiles and Fire Control on Tin Whisker test coupons. Coupons are representative lead materials and are half coated wit
.. read more
Investigation into the Mass Imaging aspects of 0.3mm Wafer Level Chip Scale Package solder paste deposition
fast approaching this horizon is the 0.3mm CSP. This device represents a major assembly revolution within the Surface mount assembly (SMT) arena. The implementation of this device will require
.. read more
Microstructure and Properties of Sn-Pb Solder Joints with Sn-Bi Finished Components
For this study,researchers from the University of Toronto produced samples of Sn-Pb solder,with additions of bismuth,
solidified at controlled cooling rates. The microstructure of the various B
.. read more
Flexural Fatigue Life Evaluation for Flexible Printed Circuit Boards
We report test results of bending characteristics of flexible printed circuit board,which contributes to the development of
higher density and more sophisticated function of mobile devices and
.. read more
Thermal Mechanical Analysis T-260 Printed Wiring Board Testing
Evaluation of printed wiring boards (PWBs) for thermal reliability during assembly and rework operations by Thermal
Mechanical Analyzer (TMA) “T-260” testing has been an accepted practice for m
.. read more
Immersion Silver and Immersion Tin IPC Plating Committee 4-14 Industry Update
The development of two new industry specifications – IPC-4553 (immersion silver IAg) and IPC-4554 (immersion tin ISn)
are well under way. Following in a tradition started with the development o
.. read more
Enhanced Embedded Passives Technology – From Distributed to Discrete
Embedded passives are entering a new phase of improved product capability and enhanced processes. Thinner,
higher capacitance embedded distributed capacitance (EDC) materials are coming to mark
.. read more
Solvent-Free Conformal Coatings – As Good as Conventional Types?
Conformal or protective coatings are widely used in
the electronics industry today and are available in a
large variety of different types and adjustments. The
"classic" or conventional conform
.. read more
Component Specific PCB Registration Characterization
Predicting printed circuit board (PCB) thickness has not historically been a difficult task. With lower layer count
boards you can afford for the prediction per layer to be wrong by a relativel
.. read more
Solderability of Sn/Cu Lead-Free Solder as a HASL Bare Board Final Finish
Sn/Cu lead-free solder is a good alternative to 63/37 solder for use in HASL processes. Solderability of Sn/Cu
surface exceeds that of 63/37 solder,nickel-gold,OSP,silver,and immersion tin both
.. read more
Stencil Options for Printing Solder Paste for .3 Mm CSP’s and 01005 Chip Components
Printing solder paste for very small components like .3mm pitch CSP’s and 01005 Chip Components is a challenge for the printing process when other larger components like RF shields,SMT Connecto
.. read more
High Frequency Circuit Materials used in the PCB Industry
Specialty high frequency circuit materials have been used in the PCB industry for decades and for many different reasons. There are several attributes of these materials that are very unique wh
.. read more
Microwave Characteristics and Applications of Liquid Crystal Polymer Flex
We present the electrical characterization of our Liquid Crystal Polymer (LCP) at microwave and millimeter frequencies and the applications of LCP to circuit components. We use several methodol
.. read more
Lessons Learned About Laminates during Migration to Lead-Free Soldering
This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr
.. read more
Effect of Conformal Coating on Tin Whisker Growth
This paper will present the testing performed to date by Lockheed Martin Missiles and Fire Control on Tin Whisker test coupons. Coupons are representative lead materials and are half coated wit
.. read more
Investigation into the Mass Imaging aspects of 0.3mm Wafer Level Chip Scale Package solder paste deposition
fast approaching this horizon is the 0.3mm CSP. This device represents a major assembly revolution within the Surface mount assembly (SMT) arena. The implementation of this device will require
.. read more
Microstructure and Properties of Sn-Pb Solder Joints with Sn-Bi Finished Components
For this study,researchers from the University of Toronto produced samples of Sn-Pb solder,with additions of bismuth,
solidified at controlled cooling rates. The microstructure of the various B
.. read more
Flexural Fatigue Life Evaluation for Flexible Printed Circuit Boards
We report test results of bending characteristics of flexible printed circuit board,which contributes to the development of
higher density and more sophisticated function of mobile devices and
.. read more
Thermal Mechanical Analysis T-260 Printed Wiring Board Testing
Evaluation of printed wiring boards (PWBs) for thermal reliability during assembly and rework operations by Thermal
Mechanical Analyzer (TMA) “T-260” testing has been an accepted practice for m
.. read more
Immersion Silver and Immersion Tin IPC Plating Committee 4-14 Industry Update
The development of two new industry specifications – IPC-4553 (immersion silver IAg) and IPC-4554 (immersion tin ISn)
are well under way. Following in a tradition started with the development o
.. read more
Enhanced Embedded Passives Technology – From Distributed to Discrete
Embedded passives are entering a new phase of improved product capability and enhanced processes. Thinner,
higher capacitance embedded distributed capacitance (EDC) materials are coming to mark
.. read more
Solvent-Free Conformal Coatings – As Good as Conventional Types?
Conformal or protective coatings are widely used in
the electronics industry today and are available in a
large variety of different types and adjustments. The
"classic" or conventional conform
.. read more
Component Specific PCB Registration Characterization
Predicting printed circuit board (PCB) thickness has not historically been a difficult task. With lower layer count
boards you can afford for the prediction per layer to be wrong by a relativel
.. read more
Solderability of Sn/Cu Lead-Free Solder as a HASL Bare Board Final Finish
Sn/Cu lead-free solder is a good alternative to 63/37 solder for use in HASL processes. Solderability of Sn/Cu
surface exceeds that of 63/37 solder,nickel-gold,OSP,silver,and immersion tin both
.. read more