Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Filling of Microvias and Through Holes by Electrolytic Copper Plating - Current Status and Future Outlook
The electronics industry is further progressing in terms of smaller,faster,smarter and more efficient electronic devices. This continuous evolving environment caused the development on various
.. read more
New Challenges for Higher Aspect Ratio: Filling Through holes and Blind Micro Vias with Copper by Reverse Pulse Plating
This paper presents systematic investigations on complete Through Hole filling for cores by a Cu electroplating process as an alternative to the common paste plugging process. This electro plat
.. read more
Next Generation Pattern Electroplating Process for Microvia Filling and Through Hole Plating
The use of electrodeposited copper for filling blind microvias has grown rapidly to become an essential and widely adopted
process used by various Printed Circuit Board (PCB) and package substr
.. read more
Blind Micro Via and Through Hole Filling in Horizontal Conveyorised Production System
This paper presents a novel electrolytic copper panel plate system incorporating equipment and specially developed electrolyte which enables filling of blind micro vias with a minimum of surfac
.. read more
The Fluidity of the Ni-Modified Sn-Cu Eutectic Lead Free Solder
One of the factors that has contributed to the establishment of the Ni-modified Sn-Cu eutectic as one of the major alternatives
to the widely promoted Sn-Ag-Cu alloys as an RoHS compliant lead-
.. read more
Filling of Microvias and Through Holes by Electrolytic Copper Plating - Current Status and Future Outlook
The electronics industry is further progressing in terms of smaller,faster,smarter and more efficient electronic devices. This continuous evolving environment caused the development on various
.. read more
New Challenges for Higher Aspect Ratio: Filling Through holes and Blind Micro Vias with Copper by Reverse Pulse Plating
This paper presents systematic investigations on complete Through Hole filling for cores by a Cu electroplating process as an alternative to the common paste plugging process. This electro plat
.. read more
Next Generation Pattern Electroplating Process for Microvia Filling and Through Hole Plating
The use of electrodeposited copper for filling blind microvias has grown rapidly to become an essential and widely adopted
process used by various Printed Circuit Board (PCB) and package substr
.. read more
Blind Micro Via and Through Hole Filling in Horizontal Conveyorised Production System
This paper presents a novel electrolytic copper panel plate system incorporating equipment and specially developed electrolyte which enables filling of blind micro vias with a minimum of surfac
.. read more
The Fluidity of the Ni-Modified Sn-Cu Eutectic Lead Free Solder
One of the factors that has contributed to the establishment of the Ni-modified Sn-Cu eutectic as one of the major alternatives
to the widely promoted Sn-Ag-Cu alloys as an RoHS compliant lead-
.. read more