Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
Optimised Vertical Process for Microvia Filling and Through Hole Metallization Under Production-like Conditions
This article summarises how a copper metallization process for simultaneous via filling and through hole plating was
developed on a laboratory scale and the challenges encountered by scale-up t
.. read more
PTFE Wettability for Electroless Copper and Direct Metallization
PTFE material is very hydrophobic and among the most difficult to deposit electroless copper or direct metallization. These
materials have very low friction,which makes a surface non-wettable.
.. read more
Optimised Vertical Process for Microvia Filling and Through Hole Metallization Under Production-like Conditions
This article summarises how a copper metallization process for simultaneous via filling and through hole plating was
developed on a laboratory scale and the challenges encountered by scale-up t
.. read more
PTFE Wettability for Electroless Copper and Direct Metallization
PTFE material is very hydrophobic and among the most difficult to deposit electroless copper or direct metallization. These
materials have very low friction,which makes a surface non-wettable.
.. read more