Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Advanced Rework Technology and Processes for Next Generation Large Area Arrays,01005,PoP and QFN Devices

BGA Rework is now largely mature,although new supplemental processes that provide improved process control such as Solder Paste Dipping and Non-Contact Site Cleaning can now be integrated into .. read more

Material Selection and Parameter Optimization for Reliable TMV Pop Assembly

The successful integration of package-on-package (PoP) stacking utilizing through mold via (TMV) technology hinges on a robust assembly process. In this study,seven dip materials were investiga .. read more

Market Forecast and Applications for 3D Packaging using Package-on-Package (PoP)

- 3D Manufacturing solutions: Flexible integration - 3D/SiP Cost of Ownership - Die vs. Package Stack Analysis - Smartphone - Package evolution - Handheld Processor Roadmap - PoP - TMV - Future .. read more

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure devi .. read more

Advanced Rework Technology and Processes for Next Generation Large Area Arrays,01005,PoP and QFN Devices

BGA Rework is now largely mature,although new supplemental processes that provide improved process control such as Solder Paste Dipping and Non-Contact Site Cleaning can now be integrated into .. read more

Material Selection and Parameter Optimization for Reliable TMV Pop Assembly

The successful integration of package-on-package (PoP) stacking utilizing through mold via (TMV) technology hinges on a robust assembly process. In this study,seven dip materials were investiga .. read more

Market Forecast and Applications for 3D Packaging using Package-on-Package (PoP)

- 3D Manufacturing solutions: Flexible integration - 3D/SiP Cost of Ownership - Die vs. Package Stack Analysis - Smartphone - Package evolution - Handheld Processor Roadmap - PoP - TMV - Future .. read more

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure devi .. read more