Knowledge Hub
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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Grain Refinement for Improved Lead-Free Solder Joint Reliability
The very small solder joints that now account for an increasing proportion of the connections on which modern electronics depends are typically made up of only a few grains,sometimes only a sin
.. read more
Elemental Compositions of Over Two Dozen Cell Phones
Twenty-nine different cells phones have been disassembled,ground up,dissolved and analyzed for elemental content,mainly for information about the metals present in the phones,but also for some
.. read more
Effects of Tin and Copper Nanotexturization on Tin Whisker Formation
The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniques (i.e.,barri
.. read more
Corrosion Resistance of Different PCB Surface Finishes in Harsh Environments
Corrosion resistance is becoming one of the most important topics in the electronics industry. Corrosion results in field
failures and huge losses,which annually total several billion U.S. doll
.. read more
Liquid Tin Corrosion and Lead Free Wave Soldering
Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The l
.. read more
Tin Whisker Growth - Substrate Effect Understanding CTE Mismatch and IMC Formation
The hypothesis that the “whisker growth phenomenon” in electrodeposited tin is a re-crystallization process driven by stress
has gained popularity among leading research institutes and industri
.. read more
Galvanic Compatibility of Immersion Gold and Immersion Silver Printed Wiring Board Finishes with Aluminum
Numerous industry studies have been performed examining the compatibility between new plating finishes and other metals
used in printed wiring assemblies. The transition to the new printed wiri
.. read more
Effects of Lead-Free Surface Finishes on Press-Fit Connections
For decades,tin-lead has been used as the primary surface finish for compliant pins and plated through holes (PTH) of
printed circuit board (PCB) in press-fit connections. Therefore,most test r
.. read more
Equipment Impacts of Lead Free Wave Soldering
The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today’s
Wave Solder systems. Users are experiencing higher maintenance frequency and re
.. read more
Grain Refinement for Improved Lead-Free Solder Joint Reliability
The very small solder joints that now account for an increasing proportion of the connections on which modern electronics depends are typically made up of only a few grains,sometimes only a sin
.. read more
Elemental Compositions of Over Two Dozen Cell Phones
Twenty-nine different cells phones have been disassembled,ground up,dissolved and analyzed for elemental content,mainly for information about the metals present in the phones,but also for some
.. read more
Effects of Tin and Copper Nanotexturization on Tin Whisker Formation
The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniques (i.e.,barri
.. read more
Corrosion Resistance of Different PCB Surface Finishes in Harsh Environments
Corrosion resistance is becoming one of the most important topics in the electronics industry. Corrosion results in field
failures and huge losses,which annually total several billion U.S. doll
.. read more
Liquid Tin Corrosion and Lead Free Wave Soldering
Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The l
.. read more
Tin Whisker Growth - Substrate Effect Understanding CTE Mismatch and IMC Formation
The hypothesis that the “whisker growth phenomenon” in electrodeposited tin is a re-crystallization process driven by stress
has gained popularity among leading research institutes and industri
.. read more
Galvanic Compatibility of Immersion Gold and Immersion Silver Printed Wiring Board Finishes with Aluminum
Numerous industry studies have been performed examining the compatibility between new plating finishes and other metals
used in printed wiring assemblies. The transition to the new printed wiri
.. read more
Effects of Lead-Free Surface Finishes on Press-Fit Connections
For decades,tin-lead has been used as the primary surface finish for compliant pins and plated through holes (PTH) of
printed circuit board (PCB) in press-fit connections. Therefore,most test r
.. read more
Equipment Impacts of Lead Free Wave Soldering
The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today’s
Wave Solder systems. Users are experiencing higher maintenance frequency and re
.. read more