Knowledge Hub
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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Assembly Reliability of TSOP/DFN PoP Stack Package
Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. This paper presents a reliability evaluation of a particular package-
.. read more
NASA-DoD Lead-Free Electronics Project: Mechanical Shock Test
Mechanical shock testing was conducted by Boeing Research and Technology (Seattle) for the NASA-DoD Lead-Free Electronics Solder Project. This project is follow-on to the Joint Council on Aging
.. read more
Drop Test Performance of A Medium Complexity Lead-Free Board After Assembly and Rework
The mechanical behavior of printed circuit assemblies (PCA) at high strain rates is very important for the reliability of products used in harsh environments. The transition to Pb-free material
.. read more
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since the European 2002/95/EC RoHS directive enforcement on 1st July 2006,a dominating part of the electronic industry suppressed the use of Pb in electronic equipment. As one of the consequenc
.. read more
The Whisker Growth Investigation of IC Packaging on the PC Board Assembly
The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in
.. read more
JCAA/JG-PP No-Lead Solder Project: -20°C to +80°C Thermal Cycle Test
Thermal cycle testing is being conducted by Boeing Phantom Works (Seattle) for the Joint Council on Aging Aircraft/Joint
Group on Pollution Prevention (JCAA/JG-PP) No-Lead Solder Project. The J
.. read more
JCAA/JG-PP No-Lead Solder Project: -55ºC to +125ºC Thermal Cycle Testing Status Report
The use of conventional tin-lead (Sn/Pb) solder in circuit board manufacturing is under ever-increasing political scrutiny due
to environmental issues and new regulations concerning lead,such a
.. read more
Assembly Reliability of TSOP/DFN PoP Stack Package
Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. This paper presents a reliability evaluation of a particular package-
.. read more
NASA-DoD Lead-Free Electronics Project: Mechanical Shock Test
Mechanical shock testing was conducted by Boeing Research and Technology (Seattle) for the NASA-DoD Lead-Free Electronics Solder Project. This project is follow-on to the Joint Council on Aging
.. read more
Drop Test Performance of A Medium Complexity Lead-Free Board After Assembly and Rework
The mechanical behavior of printed circuit assemblies (PCA) at high strain rates is very important for the reliability of products used in harsh environments. The transition to Pb-free material
.. read more
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since the European 2002/95/EC RoHS directive enforcement on 1st July 2006,a dominating part of the electronic industry suppressed the use of Pb in electronic equipment. As one of the consequenc
.. read more
The Whisker Growth Investigation of IC Packaging on the PC Board Assembly
The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in
.. read more
JCAA/JG-PP No-Lead Solder Project: -20°C to +80°C Thermal Cycle Test
Thermal cycle testing is being conducted by Boeing Phantom Works (Seattle) for the Joint Council on Aging Aircraft/Joint
Group on Pollution Prevention (JCAA/JG-PP) No-Lead Solder Project. The J
.. read more
JCAA/JG-PP No-Lead Solder Project: -55ºC to +125ºC Thermal Cycle Testing Status Report
The use of conventional tin-lead (Sn/Pb) solder in circuit board manufacturing is under ever-increasing political scrutiny due
to environmental issues and new regulations concerning lead,such a
.. read more