Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Status and Outlooks of Flip Chip Technology
Status of flip chip technology such as wafer bumping,package substrate,flip chip assembly,and underfill will be reviewed in this study. Emphasis is placed on the latest developments of these ar
.. read more
2.5D and 3D Semiconductor Package Technology: Evolution and Innovation
The electronics industry is experiencing a renaissance in semiconductor package technology. A growing number of innovative 3D package assembly methodologies have evolved to enable the electroni
.. read more
New Approaches to Develop a Scalable 3D IC Assembly Method
The challenge for 3D IC assembly is how to manage warpage and thin wafer handling in order to achieve a high assembly yield and to ensure that the final structure can pass the specified reliabi
.. read more
3D Interconnection Technologies for Electronic Products: A Perspective View of Electronic Interconnection Technologies from Chip to System
3D is the shorthand term for the three dimensions of Cartesian coordinate space X,Y and Z. With that definition in mind,one will find with little or no stretching of the imagination,that the fi
.. read more
Status and Outlooks of Flip Chip Technology
Status of flip chip technology such as wafer bumping,package substrate,flip chip assembly,and underfill will be reviewed in this study. Emphasis is placed on the latest developments of these ar
.. read more
2.5D and 3D Semiconductor Package Technology: Evolution and Innovation
The electronics industry is experiencing a renaissance in semiconductor package technology. A growing number of innovative 3D package assembly methodologies have evolved to enable the electroni
.. read more
New Approaches to Develop a Scalable 3D IC Assembly Method
The challenge for 3D IC assembly is how to manage warpage and thin wafer handling in order to achieve a high assembly yield and to ensure that the final structure can pass the specified reliabi
.. read more
3D Interconnection Technologies for Electronic Products: A Perspective View of Electronic Interconnection Technologies from Chip to System
3D is the shorthand term for the three dimensions of Cartesian coordinate space X,Y and Z. With that definition in mind,one will find with little or no stretching of the imagination,that the fi
.. read more