Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A Novel Epoxy Flux to Prevent Hot Tears at VIPPO Solder Joints
Via-in-Pad Plated Over (VIPPO) designs enable better signal quality and speed, but also cause unintended consequences. At VIPPO locations, with or without a solid copper-filled hole, the coe
.. read more
A Review of Jetting Technologies for Fluid Dispensing - Identifying the Features that Influence Productivity
As consumer products continue to reduce in price,pressure is placed upon the manufacturing of sub-components for improving cost. Back in the mid-1990s,jet valves for fluid dispensing in electro
.. read more
Control of the Underfill of Surface Mount Assemblies by Non-Destructive Techniques
Underfilling is a long-standing process issued from the micro-electronics that can enhance the robustness and the reliability of first or second-level interconnects for a variety of electronic
.. read more
Study on Solder Joint Reliability of Fine Pitch CSP
Nowadays,consumer electronic product is characterized with miniature,portable,light and high performance,especially for 3G mobile products. More and more fine pitch CSPs (0.4mm) come forth as t
.. read more
Mechanical Reliability – A New Method to Forecast Drop Shock Performance
In light of the recent technological trends within PCB manufacturing industry,there is an increasing degree of interest in understanding the influence factors of mechanical stress on the durabi
.. read more
Assembly and Reliability of 1704 I/O FCBGA and FPBGAs
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space
.. read more
Evolution Toward a Workmanship Standard For Underfill
There is no issued industry standard for the workmanship of underfills – either from the perspective of visual examination (a la A-610) or by more intrusive techniques like cross-sectioning. Th
.. read more
PCB Design and Assembly for Flip-Chip and Die Size CSP
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi
.. read more
Basic PCB Level Assembly Process Methodology for 3D Package-on-Package
The motivation for developing higher density IC packaging continues to be the market and the consumers’ expectation that
each new generation of products furnish greater functionality. The minia
.. read more
Jetting- a New Paradigm in Dispensing
Today’s advanced packages for electronics are required to meet a wide range of requirements for reliability,size and cost.
Surface mount technology still prevails in low cost electronics (telev
.. read more
PCB Design for Flipchip Components
The emerging technology known as ‘flipchips’ is poised to take over the world of the portable device. In an age when
more and more power and functionality is being offered in ever smaller packa
.. read more
Wafer Applied Underfill: Flip Chip Assembly and Reliability
Manufacturers of consumer electronic products are continuously striving to confer greater functionality to smaller,lighter,
and less expensive packages,and flip chip is an important enabling te
.. read more
Flip Chip Processing Solutions as used in System in Package Applications
Dramatic changes are underway in the computer,telecommunication,automotive,and consumer electronics
industries. Changes that demand common and pervasive requirements for active assemblies such
.. read more
Challenges in Bare Die Mounting
Traditionally,the evolution of advanced IC assemblies has been due to defense and aerospace applications,where
reliability,size and weight were at a premium,and cost was a secondary considerati
.. read more
Use of Underfill to Enhance the Thermal Cycling Reliability of Small BGAs
In this work,we have evaluated the use of underfill to enhance the reliability of small BGAs in the automotive
thermal cycling environment. Best parameters for underfilling of BGAs were develop
.. read more
Key Application Issues for Implementing Package-Applied Underfill
Applying underfill materials to the bottom of components prior to shipping to the 2nd level end-user is very desirable
in that it would eliminate the underfill process from the end-users assemb
.. read more
Study of Assembly Processes for Solder Flip Chips on FR-4 Substrates
Flip chip assembly is a key capability to enable product miniaturization. Our previous studies have investigated several flip chip
interconnection types including anisotropic conductive film or
.. read more
Enhancement of CSP Mechanical Strength using Underfill or Bonding Material
Underfill technology has been used to minimize the mismatch of the Coefficient of Thermal Expansion (CTE)
in flip chip technology. An extension of this application has been used to increase the
.. read more
A Novel Epoxy Flux to Prevent Hot Tears at VIPPO Solder Joints
Via-in-Pad Plated Over (VIPPO) designs enable better signal quality and speed, but also cause unintended consequences. At VIPPO locations, with or without a solid copper-filled hole, the coe
.. read more
A Review of Jetting Technologies for Fluid Dispensing - Identifying the Features that Influence Productivity
As consumer products continue to reduce in price,pressure is placed upon the manufacturing of sub-components for improving cost. Back in the mid-1990s,jet valves for fluid dispensing in electro
.. read more
Control of the Underfill of Surface Mount Assemblies by Non-Destructive Techniques
Underfilling is a long-standing process issued from the micro-electronics that can enhance the robustness and the reliability of first or second-level interconnects for a variety of electronic
.. read more
Study on Solder Joint Reliability of Fine Pitch CSP
Nowadays,consumer electronic product is characterized with miniature,portable,light and high performance,especially for 3G mobile products. More and more fine pitch CSPs (0.4mm) come forth as t
.. read more
Mechanical Reliability – A New Method to Forecast Drop Shock Performance
In light of the recent technological trends within PCB manufacturing industry,there is an increasing degree of interest in understanding the influence factors of mechanical stress on the durabi
.. read more
Assembly and Reliability of 1704 I/O FCBGA and FPBGAs
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space
.. read more
Evolution Toward a Workmanship Standard For Underfill
There is no issued industry standard for the workmanship of underfills – either from the perspective of visual examination (a la A-610) or by more intrusive techniques like cross-sectioning. Th
.. read more
PCB Design and Assembly for Flip-Chip and Die Size CSP
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi
.. read more
Basic PCB Level Assembly Process Methodology for 3D Package-on-Package
The motivation for developing higher density IC packaging continues to be the market and the consumers’ expectation that
each new generation of products furnish greater functionality. The minia
.. read more
Jetting- a New Paradigm in Dispensing
Today’s advanced packages for electronics are required to meet a wide range of requirements for reliability,size and cost.
Surface mount technology still prevails in low cost electronics (telev
.. read more
PCB Design for Flipchip Components
The emerging technology known as ‘flipchips’ is poised to take over the world of the portable device. In an age when
more and more power and functionality is being offered in ever smaller packa
.. read more
Wafer Applied Underfill: Flip Chip Assembly and Reliability
Manufacturers of consumer electronic products are continuously striving to confer greater functionality to smaller,lighter,
and less expensive packages,and flip chip is an important enabling te
.. read more
Flip Chip Processing Solutions as used in System in Package Applications
Dramatic changes are underway in the computer,telecommunication,automotive,and consumer electronics
industries. Changes that demand common and pervasive requirements for active assemblies such
.. read more
Challenges in Bare Die Mounting
Traditionally,the evolution of advanced IC assemblies has been due to defense and aerospace applications,where
reliability,size and weight were at a premium,and cost was a secondary considerati
.. read more
Use of Underfill to Enhance the Thermal Cycling Reliability of Small BGAs
In this work,we have evaluated the use of underfill to enhance the reliability of small BGAs in the automotive
thermal cycling environment. Best parameters for underfilling of BGAs were develop
.. read more
Key Application Issues for Implementing Package-Applied Underfill
Applying underfill materials to the bottom of components prior to shipping to the 2nd level end-user is very desirable
in that it would eliminate the underfill process from the end-users assemb
.. read more
Study of Assembly Processes for Solder Flip Chips on FR-4 Substrates
Flip chip assembly is a key capability to enable product miniaturization. Our previous studies have investigated several flip chip
interconnection types including anisotropic conductive film or
.. read more
Enhancement of CSP Mechanical Strength using Underfill or Bonding Material
Underfill technology has been used to minimize the mismatch of the Coefficient of Thermal Expansion (CTE)
in flip chip technology. An extension of this application has been used to increase the
.. read more