Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Development of Ultrasonic Flip Chip Bonding for Flexible Printed Circuit
Small form factor and high density of printed circuit boards (PCB) have been already realized by flip chip (FC) bonding
technology. However,the requirement for finer pitch PCB is still increasi
.. read more
Jetting of Underfill and Encapsulants for High-Speed Dispensing in Tight Spaces
The underfill process has become common practice in the assembly of flip chip and CSP devices and the practice of area
array assembly has been adopted by many board designers and component asse
.. read more
Development of Ultrasonic Flip Chip Bonding for Flexible Printed Circuit
Small form factor and high density of printed circuit boards (PCB) have been already realized by flip chip (FC) bonding
technology. However,the requirement for finer pitch PCB is still increasi
.. read more
Jetting of Underfill and Encapsulants for High-Speed Dispensing in Tight Spaces
The underfill process has become common practice in the assembly of flip chip and CSP devices and the practice of area
array assembly has been adopted by many board designers and component asse
.. read more