Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Can 150μm Pitch Flip Chip be Done on Standard SMT Lines?
As miniaturization trends continue in the electronics industry, System in Package (SiP) technology is gaining more and more traction. In many ways, some SiP modules are just surface mount te
.. read more
Warpage Issues and Assembly Challenges Using Coreless Package Substrate
Coreless technology in package substrate has been developed to satisfy the increasing demand of lighter,smaller and superior electrical performance regarding as the future trend in electronic a
.. read more
Application Assessment of High Throughput Flip Chip Assembly for a High Lead-Eutectic Solder Cap Interconnect System Using No-Flow Underfill Materials
Flip Chip on Board (FCOB) is one of the most quickly growing segments in advanced electronic packaging. In many cases,assembly processes are not capable of providing the high throughputs needed
.. read more
Effects of Substrate Design on Underfill Voiding Using the Low Cost,High Throughput Flip Chip Assembly Process and No-Flow Underfill Materials
The formation of underfill voids is an area of concern in the low cost,high throughput,or “no-flow” flip chip assembly process. This assembly process involves placement of a flip chip device di
.. read more
Can 150μm Pitch Flip Chip be Done on Standard SMT Lines?
As miniaturization trends continue in the electronics industry, System in Package (SiP) technology is gaining more and more traction. In many ways, some SiP modules are just surface mount te
.. read more
Warpage Issues and Assembly Challenges Using Coreless Package Substrate
Coreless technology in package substrate has been developed to satisfy the increasing demand of lighter,smaller and superior electrical performance regarding as the future trend in electronic a
.. read more
Application Assessment of High Throughput Flip Chip Assembly for a High Lead-Eutectic Solder Cap Interconnect System Using No-Flow Underfill Materials
Flip Chip on Board (FCOB) is one of the most quickly growing segments in advanced electronic packaging. In many cases,assembly processes are not capable of providing the high throughputs needed
.. read more
Effects of Substrate Design on Underfill Voiding Using the Low Cost,High Throughput Flip Chip Assembly Process and No-Flow Underfill Materials
The formation of underfill voids is an area of concern in the low cost,high throughput,or “no-flow” flip chip assembly process. This assembly process involves placement of a flip chip device di
.. read more